XC3S1400AN-4FGG484C

The XC3S1400AN-4FGG484C is a Spartan®-3AN Field Programmable Gate Array (FPGA) IC designed for programmable digital logic implementations. It provides a balance of logic capacity, on-chip memory and I/O density in a compact 484-BBGA package for commercial-grade applications.

With 25,344 logic elements and approximately 0.59 Mbits of embedded memory, this device is suited to designs that require substantial gate density, multiple I/O connections and controlled supply voltage operation between 1.14 V and 1.26 V.

Key Features

• Logic Capacity  25,344 logic elements and approximately 1,400,000 gates provide significant programmable logic resources for custom digital functions.
• On-Chip Memory  Approximately 0.59 Mbits of embedded RAM supports data buffering, state storage and internal memory requirements.
• I/O Density  372 I/O pins enable broad connectivity for peripheral interfaces, signal routing and multi-channel designs.
• Power  Specified operating supply range from 1.14 V to 1.26 V for core power management and system integration.
• Package & Mounting  484-BBGA package (supplier package listed as 484-FBGA, 23 × 23) in a surface-mount form factor for high-density PCB assembly.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C suitable for standard commercial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom digital logic implementations  Use the device’s 25,344 logic elements to implement tailored state machines, datapaths and control logic.
• Memory-backed processing  Leverage approximately 0.59 Mbits of embedded RAM for buffering, lookup tables and small on-chip data storage.
• I/O-rich systems  The 372 available I/O pins make this FPGA suitable for designs requiring multiple peripheral interfaces or signal channels.

Unique Advantages

• Significant programmable capacity  High logic element and gate counts enable complex designs without immediate migration to larger devices.
• Integrated memory resources  On-chip RAM reduces the need for external memory in mid-density applications, simplifying BOM and board layout.
• Extensive I/O  372 I/O pins provide flexibility for interfacing with sensors, controllers and bus systems.
• Compact, high-density package  484-BBGA / 484-FBGA (23 × 23) package supports dense PCB integration while maintaining high pin count.
• Commercial temperature and RoHS compliance  Clear operating range and RoHS status facilitate design planning and regulatory alignment for commercial products.

Why Choose XC3S1400AN-4FGG484C?

The XC3S1400AN-4FGG484C positions itself as a commercially graded FPGA option that combines substantial logic capacity, on-chip RAM and a high I/O count within a compact 484-BBGA package. Its specified core voltage range and defined operating temperature make it suitable for a range of commercial electronic designs requiring programmable logic and moderate memory resources.

This device is appropriate for engineers and teams building mid-density programmable logic solutions who value integrated memory, plentiful I/O and a surface-mount, high-density package for PCB-constrained designs.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the XC3S1400AN-4FGG484C.