XC3S1400AN-4FGG676C

The XC3S1400AN-4FGG676C is a Spartan®-3AN field programmable gate array (FPGA) supplied in a 676-ball FBGA package. It provides a hardware-configurable platform with a large logic resource set, substantial on-chip memory, and a high I/O count for designs that require flexible programmable logic integration.

With 25,344 logic elements, approximately 0.59 Mbits of embedded memory, and 502 user I/Os, this device is positioned for applications that demand sizable programmable logic density and extensive connectivity while operating within a commercial temperature range.

Key Features

• Core Logic  25,344 logic elements and 1,400,000 gates provide a substantial resource pool for implementing complex digital functions.
• Configurable Logic Blocks  2,816 configurable logic blocks support broad logic partitioning and modular design approaches.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM enables data buffering, FIFO implementation, and localized storage for high-throughput designs.
• I/O Capacity  502 I/O pins accommodate extensive peripheral interfacing, protocol bridging, and multi-channel signal access.
• Package and Mounting  676-FBGA (27 × 27 mm) package in a surface-mount form factor supports compact board layouts and high-density system integration.
• Power  Supported supply voltage range of 1.14 V to 1.26 V allows precise power provisioning in system designs.
• Operating Range  Commercial-grade operation from 0 °C to 85 °C suitable for standard commercial electronics environments.
• RoHS Compliance  Device is RoHS compliant, meeting common environmental and lead-free requirements for electronic assemblies.

Typical Applications

• Embedded Systems  Implement custom logic, data handling, and glue functions where reprogrammability and sizable logic resources are required.
• Prototyping and Development  Use the device for hardware prototyping and iterative design cycles that benefit from programmable logic density and flexible I/O.
• Interface and Protocol Bridging  Leverage the high I/O count to bridge multiple interfaces, aggregate signals, and perform protocol conversion tasks.
• Data Buffering and Processing  Employ the on-chip RAM and logic capacity for localized buffering, parallel data paths, and application-specific data processing.

Unique Advantages

• Significant Logic Capacity: 25,344 logic elements allow integration of complex custom logic, reducing dependence on multiple discrete components.
• Large I/O Count: 502 I/Os simplify board-level connectivity and support multi-channel interfacing without external multiplexing.
• Substantial On-Chip Memory: Approximately 0.59 Mbits of embedded RAM enables efficient data buffering and state storage within the FPGA.
• Compact, High-Density Package: 676-FBGA (27 × 27 mm) package supports high-density PCB designs while maintaining surface-mount assembly compatibility.
• Controlled Power Range: Defined supply voltage window (1.14 V to 1.26 V) assists in predictable power design and regulation for the FPGA core.
• RoHS Compliant: Meets lead-free and environmental requirements for standard commercial electronics production.

Why Choose XC3S1400AN-4FGG676C?

The XC3S1400AN-4FGG676C combines a large pool of logic elements, substantial embedded RAM, and an extensive I/O count in a compact 676-FBGA package, offering a balance of integration and connectivity for commercial electronic designs. Its defined power and temperature ranges make it suitable for a wide range of standard commercial applications that require reliable, reconfigurable hardware logic.

This device is well suited to engineers and teams developing systems that benefit from on-chip programmability and scalability—providing tangible design consolidation, simplified board-level routing, and the flexibility to iterate hardware functionality without extensive redesign.

Request a quote or submit an inquiry for pricing and availability of XC3S1400AN-4FGG676C to begin integrating this Spartan®-3AN FPGA into your next design.