XC3S1400AN-5FGG676C

The XC3S1400AN-5FGG676C is a Spartan®-3AN field programmable gate array (FPGA) from AMD offered in a 676-ball fine-pitch BGA package. It provides a combination of logic density, embedded memory and a high count of I/O for commercial electronic designs.

With 25,344 logic elements, approximately 0.59 Mbits of embedded memory and 502 I/Os, this device targets designs that require dense digital logic, substantial on-chip RAM and extensive external connectivity while operating at low core voltages.

Key Features

• Core Logic 25,344 logic elements (LEs) enabling complex digital functions and custom logic implementation.
• On-Chip Memory Total on-chip RAM of 589,824 bits — approximately 0.59 Mbits of embedded memory for buffering, FIFOs and local data storage.
• I/O Capacity 502 user I/Os to support wide external bus interfaces, sensor arrays and multi-channel connectivity.
• Device Density Approximately 1,400,000 gates for implementing mid-range integration of glue logic, controllers and datapaths.
• Power Supply Core voltage range of 1.14 V to 1.26 V to match target system power rails and optimize core power consumption.
• Package and Mounting 676-FBGA (27 × 27 mm) supplier device package; surface-mount 676-BGA package case for compact PCB integration.
• Operating Range and Grade Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance RoHS-compliant material composition for environmental compliance in commercial products.

Typical Applications

• Embedded Systems – Implements custom logic, protocol handling and on-board control where a mix of logic density and embedded RAM is required.
• High-Density I/O Interfaces – Serves as a hub for multi-channel I/O, signal routing and interface translation using its 502 available I/Os.
• Data Buffering and Stream Processing – Uses the on-chip RAM and logic resources for buffering, packet handling or streaming data tasks.
• Prototyping and Development – Provides a commercially graded FPGA platform for design validation and functional prototyping requiring mid-range gate density.

Unique Advantages

• High Logic Capacity: 25,344 logic elements and ~1.4M gates enable substantial integration of custom logic without external ASICs.
• Significant On-Chip Memory: Approximately 0.59 Mbits of embedded RAM reduces the need for external memory in many buffering and intermediate storage functions.
• Extensive I/O Count: 502 I/Os allow flexible interfacing to multiple peripherals, sensors, buses and external devices on a single chip.
• Compact Packaging: 676-FBGA (27 × 27 mm) surface-mount package supports dense PCB layouts while maintaining high pin count.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronic products and systems.
• RoHS Compliance: Environmentally compliant materials help simplify regulatory considerations for commercial products.

Why Choose XC3S1400AN-5FGG676C?

The XC3S1400AN-5FGG676C combines mid-range logic density, meaningful on-chip memory and a high I/O count in a compact 676-FBGA package, making it a practical choice for commercial designs that require integrated digital logic and extensive connectivity. Its low core voltage range and RoHS compliance align with contemporary power and environmental requirements.

Manufactured by AMD and based on the Spartan®-3AN family, this FPGA is positioned for engineers and procurement teams building embedded systems, interface hubs and prototype platforms that benefit from integrated memory, high I/O availability and a commercial operating range.

Request a quote or submit a purchase inquiry today to check availability and receive pricing information for the XC3S1400AN-5FGG676C.