XC3S1500-4FG456I

The XC3S1500-4FG456I is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD, offered in a 456-ball BGA package. It provides a dense, reconfigurable logic fabric with a substantial I/O complement and embedded memory for programmable digital designs.

With approximately 29,952 logic elements, about 0.59 Mbits of on-chip RAM, and 333 user I/Os, this industrial-grade device addresses applications that require flexible digital logic, significant I/O capacity, and operation across a wide temperature range.

Key Features

• Core Logic  Approximately 29,952 logic elements and 1,500,000 gates provide a substantial programmable logic resource for custom digital circuits.
• Embedded Memory  Total on-chip RAM of 589,824 bits (approximately 0.59 Mbits) supports local buffering, state machines, and small data stores without external memory.
• I/O Capacity  333 user I/Os enable complex interfacing, multiple bus connections, and flexible signal routing for mixed-signal systems.
• Package and Mounting  456-ball BGA package (supplier device package: 456-FBGA, 23×23) in a surface-mount form factor for compact board integration.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match target system power domains.
• Industrial Temperature Rating  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance  RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• Programmable digital logic and prototyping  Use the FPGA fabric and embedded RAM to implement custom digital functions, algorithm validation, and hardware prototypes.
• I/O-rich interfacing and protocol bridging  The 333 available I/Os support board-level bridging, bus interfacing, and multi-channel connectivity tasks.
• Industrial control and automation  Industrial-grade temperature range and robust packaging make this device suitable for industrial control, signal conditioning, and embedded system control applications.

Unique Advantages

• High logic density: Approximately 29,952 logic elements and 1.5 million gates allow consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
• On-chip memory for local buffering: Approximately 0.59 Mbits of embedded RAM enables internal data storage for state machines and small FIFO/buffer implementations without external memory.
• Extensive I/O count: 333 user I/Os provide flexibility to interface with numerous peripherals and buses directly from the FPGA.
• Compact BGA package: The 456-ball BGA (23×23) surface-mount package supports high-density PCB layouts while maintaining a robust mechanical profile.
• Industrial temperature capability: Rated from −40 °C to 100 °C for reliability in demanding thermal environments.
• Regulatory compliance: RoHS compliance helps meet environmental requirements during product development and deployment.

Why Choose XC3S1500-4FG456I?

The XC3S1500-4FG456I combines a substantial programmable logic resource, meaningful on-chip memory, and a large I/O count in a compact 456-BBGA package with industrial temperature rating. This combination is well suited for designs that require consolidated digital logic, flexible interfacing, and reliable operation across a wide temperature range.

Engineers and procurement teams seeking a reconfigurable solution with robust I/O capacity and industrial-grade specifications will find this FPGA appropriate for mid-density programmable applications where board space and environmental resilience are important.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S1500-4FG456I and discuss how it fits your next design.