XC3S1500-4FG320I

The XC3S1500-4FG320I is a Spartan®-3 field programmable gate array (FPGA) manufactured by AMD. It provides a mid-range combination of logic capacity, embedded memory, and I/O resources in a 320-ball BGA package targeted for industrial applications.

Key device characteristics include 29,952 logic elements, approximately 0.59 Mbits of on-chip RAM, 221 I/Os, support for a 1.14–1.26 V supply range, and an operating temperature range of −40 °C to 100 °C—making it suitable for designs that require robust logic integration and industrial temperature operation.

Key Features

• Core Logic 29,952 logic elements and 3,328 configurable logic blocks (CLBs) provide substantial on-chip programmable logic resources for mid-range FPGA designs.
• Embedded Memory Approximately 0.59 Mbits of total on-chip RAM (589,824 bits) for data buffering, state storage, and embedded memory functions.
• I/O Resources 221 user I/O pins to support a wide range of peripheral interfaces and board-level connectivity requirements.
• Device Capacity Approximately 1,500,000 gates of logic capacity for implementing complex combinational and sequential functions.
• Power Supports a core voltage supply range of 1.14 V to 1.26 V to match system power constraints and design requirements.
• Package and Mounting 320-ball BGA (320-FBGA, 19×19) package in a surface-mount form factor for compact, high-density PCB designs.
• Temperature Grade Industrial temperature range from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Environmental Compliance RoHS compliant, meeting common materials restrictions for electronic assembly.

Typical Applications

• Industrial Control and Automation — Suitable for control logic and interface tasks where an industrial temperature range and substantial I/O count are required.
• Embedded Logic and Glue Logic — Use to consolidate discrete logic, protocol bridging, and custom state machines using available logic elements and embedded RAM.
• Data Buffering and Signal Processing — On-chip RAM and logic capacity can be applied for buffering, finite-state processing, and intermediate data handling.

Unique Advantages

• High Logic Density: 29,952 logic elements enable implementation of substantial digital logic within a single device, reducing component count.
• Significant On-Chip Memory: Approximately 0.59 Mbits of embedded RAM provide local storage for buffering and state data without external memory.
• Generous I/O Count: 221 I/Os deliver flexible interfacing options for multiple peripherals and board-level signals.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in demanding environments.
• Compact BGA Packaging: 320-ball FBGA (19×19) combines high pin count with a surface-mount form factor for dense PCB integration.
• Regulatory Compliance: RoHS compliant to support environmentally conscious product designs.

Why Choose XC3S1500-4FG320I?

The XC3S1500-4FG320I positions itself as a mid-range Spartan-3 FPGA offering a balanced mix of logic elements, embedded RAM, and I/O resources in a compact 320-BGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for robust, long-life designs that require on-device programmability and a high pin count.

Manufactured by AMD, this device is suited to customers designing applications that need approximately 1.5 million gates of logic capacity with flexible power and temperature specifications, offering a scalable and integrated solution for a variety of embedded and control-oriented projects.

Request a quote or submit a price inquiry today to evaluate the XC3S1500-4FG320I for your next design.