XC3S1500-4FG676C

The XC3S1500-4FG676C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD providing a high-density, programmable logic platform in a compact BGA package. It combines substantial logic capacity and embedded memory with a large number of I/O resources to address complex digital designs that require flexible, reconfigurable hardware.

With 29,952 logic elements, approximately 0.59 Mbits of on-chip RAM, and 487 I/O pins, this commercial-grade device is suited to designs that demand significant gate density, extensive interfacing, and low-voltage operation within the 0 °C to 85 °C operating range.

Key Features

• Core Logic  29,952 logic elements and approximately 1,500,000 gates provide substantial capacity for implementing custom digital functions and complex logic blocks.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM supports data buffering, lookup tables, and local storage for state machines and signal processing tasks.
• I/O and Connectivity  487 user I/O pins enable dense external interfacing for high-pin-count applications and multi-channel connectivity.
• Package and Mounting  676-BGA package (supplier device package: 676-FBGA, 27×27) designed for surface-mount assembly, delivering a compact footprint for space-constrained boards.
• Power  Device supply voltage range of 1.14 V to 1.26 V supports low-voltage system designs.
• Operating Conditions  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom Digital Processing  Implement application-specific accelerators and control logic using the device's large logic capacity and embedded RAM.
• High-Density I/O Control  Manage complex multi-channel interfaces and parallel data paths leveraging 487 I/O pins.
• Prototyping and Production FPGA Designs  Use the programmable fabric for rapid iteration of digital designs and transition to production in a compact BGA package.
• Embedded System Integration  Integrate control, glue-logic, and memory-intensive blocks on-chip to reduce external components and simplify board design.

Unique Advantages

• High Logic Density: 29,952 logic elements allow implementation of sizable digital systems on a single device, reducing part count and system complexity.
• Significant On-Chip Memory: Approximately 0.59 Mbits of embedded RAM supports buffering and local data storage, improving data throughput and latency.
• Extensive I/O Capacity: 487 I/O pins provide flexibility for connecting a wide range of peripherals, interfaces, and sensors without external I/O expanders.
• Compact BGA Footprint: 676-BGA (676-FBGA, 27×27) packaging enables a small PCB footprint while supporting high pin counts for dense designs.
• Low-Voltage Operation: Narrow supply range (1.14 V to 1.26 V) supports integration into low-voltage systems and helps manage power budgets.
• RoHS Compliant: Meets environmental directives for lead-free assembly and materials compliance.

Why Choose XC3S1500-4FG676C?

The XC3S1500-4FG676C positions itself as a durable, commercially graded FPGA option for designers seeking a balance of logic capacity, embedded memory, and high I/O count in a compact BGA package. Its combination of nearly 30k logic elements, substantial on-chip RAM, and 487 I/O enables integration of complex digital subsystems while reducing external component count.

This device is a fit for engineering teams developing FPGA-based controllers, interface hubs, and custom processing blocks that require reconfigurability, significant gate density, and a compact board footprint. Backed by AMD manufacturing, it provides a stable platform for both prototyping and production designs within commercial operating conditions.

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