XC3S1500-4FGG456C

The XC3S1500-4FGG456C is a Spartan®-3 Field Programmable Gate Array (FPGA) manufactured by AMD. It delivers a substantial array of programmable logic, embedded memory, and I/O resources in a compact BGA package for commercial-grade designs.

With 29,952 logic elements, approximately 0.59 Mbits of on-chip RAM (589,824 bits), and 333 I/O, this device is positioned for applications that require configurable digital logic, moderate embedded memory, and a high I/O count within a surface-mount BGA footprint.

Key Features

• Core Architecture Spartan®-3 FPGA family device manufactured by AMD, offering programmable logic resources for custom digital design.
• Logic Resources 3,328 CLBs and 29,952 logic elements (cells) to implement complex combinational and sequential logic functions.
• Embedded Memory Approximately 0.59 Mbit of on-chip RAM (589,824 total RAM bits) for data buffering, lookup tables, and state storage.
• I/O Capacity 333 user I/O pins suitable for interfacing with multiple peripherals and system-level signals.
• Gate Equivalence Equivalent to 1,500,000 gates, providing a measure of overall integration density.
• Power Supported core voltage supply range of 1.14 V to 1.26 V for device operation.
• Package & Mounting 456-ball BGA package (456-BBGA) with supplier device package listed as 456-FBGA (23x23); surface-mount mounting type.
• Temperature & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Unique Advantages

• Substantial programmable logic capacity: 29,952 logic elements and 3,328 CLBs enable implementation of sizable custom logic blocks without external ASICs.
• On-chip memory for local buffering: Approximately 0.59 Mbit of embedded RAM reduces dependence on external memory for many intermediate storage needs.
• High I/O count: 333 I/O pins provide flexible interfacing options for multi-signal systems and peripheral integration.
• Compact BGA footprint: 456-ball BGA (supplier package 456-FBGA (23x23)) delivers a high-density package suitable for space-constrained PCB designs.
• Commercial temperature and compliance: 0 °C to 85 °C operating range and RoHS compliance support standard commercial product deployments.

Why Choose XC3S1500-4FGG456C?

The XC3S1500-4FGG456C balances a large logic resource pool, meaningful on-chip memory, and extensive I/O in a single, surface-mount BGA package. Its specification set makes it suitable for commercial designs that require configurable digital logic, moderate embedded storage, and a high number of external interfaces.

Backed by AMD's Spartan®-3 family pedigree, this device offers a combination of integration density and package-level compactness that supports scalable design development and straightforward system integration for commercial applications.

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