XC3S1500-4FGG676C

The XC3S1500-4FGG676C is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD designed for commercial programmable-logic applications. It combines a high logic element count with substantial embedded RAM and a large I/O complement to support complex glue-logic, interfacing, and integration tasks in commercial electronic systems.

Key architectural highlights include 3,328 CLBs and approximately 29,952 logic elements, roughly 0.59 Mbits of on-chip RAM, and up to 487 I/O in a compact 676-ball BGA package, all at a commercial operating temperature range and low-voltage core supply.

Key Features

• Core Logic  3,328 CLBs delivering approximately 29,952 logic elements and an estimated 1,500,000 gates for implementing complex digital functions.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (589,824 bits) to support deep buffering, FIFOs, and local data storage.
• I/O Capacity  Up to 487 I/O pins to facilitate broad interfacing and multi-domain connectivity.
• Power and Voltage  Core voltage supply range of 1.14 V to 1.26 V for standard low-voltage FPGA power architectures.
• Package and Mounting  676-BGA supplier device package (676-FBGA, 27×27) in a surface-mount form factor for high-density PCB designs.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance  RoHS compliant, meeting standard environmental requirements for lead-free assemblies.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic, data path functions, and protocol handling where a commercial-grade FPGA is required.
• Interface Bridging and Glue Logic  Use the high I/O count and abundant logic resources to connect disparate subsystems and implement bus/fabric adapters.
• Data Buffering and Local Memory Tasks  Leverage the approximately 0.59 Mbits of on-chip RAM for buffering, small packet storage, and temporary data staging.

Unique Advantages

• High Logic Density:  Approximately 29,952 logic elements and 3,328 CLBs provide substantial capacity for medium-complexity designs without external logic.
• Generous I/O Count:  487 I/O pins enable broad connectivity and simplify board-level routing for multi-interface applications.
• Embedded Memory Resources:  About 0.59 Mbits of on-chip RAM reduces dependence on external memory for many buffering and control tasks.
• Compact BGA Package:  676-FBGA (27×27) supports high-density PCB layouts while maintaining a standard surface-mount profile.
• Commercial Temperature and RoHS Compliance:  Rated for 0 °C to 85 °C operation and RoHS compliant for lead-free manufacturing.
• Predictable Low-Voltage Operation:  Core supply range of 1.14 V to 1.26 V aligns with common low-voltage power rails used in contemporary systems.

Why Choose XC3S1500-4FGG676C?

The XC3S1500-4FGG676C is positioned for designers who need a commercially rated FPGA with a balance of logic density, on-chip memory, and large I/O capacity in a compact BGA package. Its combination of approximately 29,952 logic elements, 3,328 CLBs, roughly 0.59 Mbits of embedded RAM, and up to 487 I/O makes it suitable for a wide range of commercial electronic designs that require flexible, reprogrammable logic.

As an AMD Spartan®-3 device, it provides a predictable platform for medium-complexity integration tasks where commercial temperature operation, RoHS compliance, and a compact footprint are important considerations.

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