XC3S1500-4FGG676I

The XC3S1500-4FGG676I is an AMD Spartan®-3 Field Programmable Gate Array with 29,952 logic elements and approximately 0.59 Mbits of embedded memory. It provides a high-density, reconfigurable fabric in a 676-ball BGA package suited for integration into space-constrained boards.

Designed for industrial applications, this device supports a core supply range of 1.14 V to 1.26 V and an operating temperature range of -40 °C to 100 °C. The device offers substantial I/O (487 pins) and an estimated 1,500,000 gates to implement custom digital logic and system functions.

Key Features

• Core Capacity  29,952 logic elements providing a substantial logic resource pool for implementing complex digital designs and state machines.
• Configurable Logic Blocks  3,328 logic blocks (internal architecture detail) enabling modular placement of logic functions across the fabric.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM to support buffering, FIFOs, and small data stores without external memory.
• I/O Density  487 I/O pins to support wide parallel interfaces, multiple peripherals, and flexible board-level connectivity.
• Gate Count  Approximately 1,500,000 gates for extensive combinational and sequential logic capacity.
• Package & Mounting  676-ball FBGA (27 × 27) package, surface-mountable for compact, high-density PCB designs.
• Power  Core voltage supply range 1.14 V to 1.26 V to match common FPGA core power rails and power-management strategies.
• Industrial Temperature Range  Rated for -40 °C to 100 °C operation, supporting deployment in industrial environments.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

• Industrial Control  Implement custom control logic, timing, and interfacing functions benefiting from the device's industrial temperature rating and extensive I/O count.
• Embedded Processing & Acceleration  Create hardware-accelerated datapaths and custom peripherals using the large logic element pool and on-chip RAM for intermediate data storage.
• Prototyping and System Integration  Rapidly prototype digital systems and integrate multiple I/O standards on a single device backed by substantial gate capacity.
• High-Density I/O Systems  Support boards requiring many parallel or multiplexed connections using the device's 487 I/O pins in a compact FBGA footprint.

Unique Advantages

• High Logic Capacity: 29,952 logic elements give designers the headroom to implement complex state machines, datapaths, and custom peripherals without external logic.
• Embedded Memory On-Chip: Approximately 0.59 Mbits of RAM reduces dependence on external memory for buffering and small data storage, simplifying board-level design.
• Extensive I/O: 487 I/O pins enable broad peripheral connectivity and flexible interface implementations on a single device.
• Industrial Robustness: Rated for -40 °C to 100 °C operation, suitable for deployments where extended temperature tolerance is required.
• Compact High-Density Package: 676-FBGA (27 × 27) package balances I/O density with a small PCB footprint for space-constrained applications.
• Vendor Backing: Supplied by AMD, providing a known manufacturer source for procurement and lifecycle considerations.

Why Choose XC3S1500-4FGG676I?

The XC3S1500-4FGG676I positions itself as a high-capacity Spartan®-3 FPGA option for designs that require a balance of large logic resources, substantial on-chip memory, and wide I/O in a compact, industrial-rated package. Its combination of nearly 30k logic elements, approximately 0.59 Mbits of embedded RAM, and 487 I/O pins makes it well suited for embedded processing, industrial control, and dense I/O applications.

With a defined core voltage range and a proven BGA footprint, this device provides predictable integration into power and board designs while supporting deployments across a broad temperature range. Choose this FPGA when you need reconfigurable digital capacity from a recognized manufacturer with RoHS-compliant manufacturing.

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