XC3S1500-4FGG456I

The XC3S1500-4FGG456I is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD. It delivers a programmable logic platform with 29,952 logic elements, approximately 0.59 Mbits of embedded RAM, and 333 user I/O pins in a 456-ball BGA package.

Designed for applications that require substantial on-chip logic, memory and I/O density within an industrial temperature range, this device offers a balance of programmable capacity, I/O count and package integration for system designs constrained by board space and power envelope.

Key Features

• Programmable Logic Capacity — 29,952 logic elements providing up to 1,500,000 gates for implementing custom digital functions and control logic.
• On‑Chip Memory — Approximately 0.59 Mbits of embedded RAM to support buffers, state storage and intermediate data processing without external memory.
• I/O Density — 333 user I/O pins suitable for connecting multiple peripherals, buses and interfaces directly to the FPGA fabric.
• Package & Mounting — 456-ball BGA (supplier device package 456-FBGA, 23×23) in a surface-mount form factor for high-density board integration.
• Power Supply — Core voltage range of 1.14 V to 1.26 V to match system power-rail planning and regulator selection.
• Operating Range & Grade — Industrial-grade device rated for operation from −40°C to 100°C for robust performance in temperature-variable environments.
• Standards Compliance — RoHS compliant for regulatory alignment with lead-free manufacturing requirements.

Typical Applications

• High‑I/O Control and Interface — Use the device's 333 I/O pins to implement multi‑bus interfaces, protocol bridging and dense peripheral connectivity.
• Embedded Logic and Glue — Implement custom control logic, state machines and glue logic leveraging the 29,952 logic elements to reduce external components.
• On‑Chip Data Buffering — Use approximately 0.59 Mbits of embedded RAM for packet buffering, FIFOs and temporary storage to streamline data paths.
• Industrial Electronics — Industrial temperature rating supports deployment in factory automation, instrumentation and other temperature‑variable systems.

Unique Advantages

• Significant Logic Density: 29,952 logic elements and 1,500,000 gates enable complex digital designs without immediate need for additional ASICs or CPLDs.
• Substantial On‑Chip Memory: Approximately 0.59 Mbits of embedded RAM reduces dependence on external memory for many buffering and state storage tasks.
• High I/O Count: 333 I/O pins allow direct connection to multiple sensors, controllers and external devices, simplifying board-level routing.
• Compact BGA Package: 456-ball FBGA (23×23) offers high pin density in a surface-mount package suited for space-constrained PCBs.
• Industrial Temperature Rating: −40°C to 100°C operation supports reliability in temperature-challenging environments.
• RoHS Compliant: Meets lead‑free manufacturing requirements for regulatory and supply-chain compatibility.

Why Choose XC3S1500-4FGG456I?

The XC3S1500-4FGG456I positions itself as a versatile Spartan®-3 FPGA option where a substantial mix of logic, embedded memory and I/O is required within an industrial temperature envelope. Its combination of nearly 30k logic elements, significant on‑chip RAM and a high I/O count in a compact 456‑ball BGA makes it suitable for designs seeking integrated programmable functionality while conserving board space.

For teams developing control systems, interface bridges or embedded logic subsystems, this device provides a scalable, RoHS‑compliant programmable platform supported by AMD's Spartan‑3 family documentation and resources.

If you would like pricing, availability or to request a formal quote for the XC3S1500-4FGG456I, submit an inquiry to our sales team and include your quantity and required delivery timeframe.