XC3S1500-5FG456C
| Part Description |
Spartan®-3 Field Programmable Gate Array (FPGA) IC 333 589824 29952 456-BBGA |
|---|---|
| Quantity | 1,156 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 456-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 456-BBGA | Number of I/O | 333 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3328 | Number of Logic Elements/Cells | 29952 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 589824 |
Overview of XC3S1500-5FG456C – Spartan®-3 FPGA, 456-BBGA
The XC3S1500-5FG456C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC offered in a 456-ball BGA package. It provides a balanced combination of programmable logic capacity, on-chip memory, and I/O density for commercial-grade designs.
With 3,328 configurable logic blocks (CLBs) delivering 29,952 logic elements, approximately 0.59 Mbits of embedded memory and 333 user I/Os, this device targets designs that require significant logic integration and flexible external interfacing within a surface-mount BGA footprint.
Key Features
- Core Logic 3328 CLBs (configurable logic blocks) providing 29,952 logic elements for implementing custom digital logic.
- Embedded Memory Approximately 0.59 Mbits of on-chip RAM (589,824 bits) to support data buffering and storage.
- I/O Capacity 333 user I/O pins to interface with external peripherals and systems.
- Gate Count Approximately 1,500,000 gates for complex logic functions and integration.
- Power Supply Operating core voltage range of 1.14 V to 1.26 V.
- Package & Mounting 456-BBGA package; supplier device package listed as 456-FBGA (23×23). Surface-mount device.
- Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Regulatory RoHS compliant.
Unique Advantages
- Substantial Logic Capacity: The combination of 3,328 CLBs and 29,952 logic elements enables implementation of sizeable custom logic blocks within a single FPGA.
- On-Chip Memory: About 0.59 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate storage.
- High I/O Density: 333 I/Os provide flexibility for interfacing with multiple peripherals, buses, and external components.
- Compact BGA Footprint: 456-BBGA (456-FBGA, 23×23) package supports dense board layouts while retaining significant logic and I/O capacity.
- Commercial Temperature Range: Rated for 0 °C to 85 °C to align with general-purpose electronic applications.
- Standards Compliance: RoHS compliance addresses environmental and materials considerations for many procurement requirements.
Why Choose XC3S1500-5FG456C?
The XC3S1500-5FG456C positions itself as a commercial-grade Spartan®-3 FPGA that combines nearly 30k logic elements, substantial on-chip RAM, and a high I/O count in a 456-ball BGA surface-mount package. Its electrical and thermal ratings—1.14 V to 1.26 V supply range and 0 °C to 85 °C operating temperature—make it suitable for a wide range of board-level designs requiring integrated programmable logic.
For engineers and procurement teams seeking a field-programmable solution with clear, verifiable capacity and package specifications, the XC3S1500-5FG456C offers scalable integration and RoHS compliance to support longer-term design lifecycles.
Request a quote or submit an inquiry to obtain pricing and availability for the XC3S1500-5FG456C and to discuss how this FPGA can meet your design requirements.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








