XC3S1500-5FG456C

IC FPGA 333 I/O 456FBGA
Part Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 333 589824 29952 456-BBGA

Quantity 1,156 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package456-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case456-BBGANumber of I/O333Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3328Number of Logic Elements/Cells29952
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC3S1500-5FG456C – Spartan®-3 FPGA, 456-BBGA

The XC3S1500-5FG456C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC offered in a 456-ball BGA package. It provides a balanced combination of programmable logic capacity, on-chip memory, and I/O density for commercial-grade designs.

With 3,328 configurable logic blocks (CLBs) delivering 29,952 logic elements, approximately 0.59 Mbits of embedded memory and 333 user I/Os, this device targets designs that require significant logic integration and flexible external interfacing within a surface-mount BGA footprint.

Key Features

  • Core Logic  3328 CLBs (configurable logic blocks) providing 29,952 logic elements for implementing custom digital logic.
  • Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (589,824 bits) to support data buffering and storage.
  • I/O Capacity  333 user I/O pins to interface with external peripherals and systems.
  • Gate Count  Approximately 1,500,000 gates for complex logic functions and integration.
  • Power Supply  Operating core voltage range of 1.14 V to 1.26 V.
  • Package & Mounting  456-BBGA package; supplier device package listed as 456-FBGA (23×23). Surface-mount device.
  • Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Regulatory  RoHS compliant.

Unique Advantages

  • Substantial Logic Capacity: The combination of 3,328 CLBs and 29,952 logic elements enables implementation of sizeable custom logic blocks within a single FPGA.
  • On-Chip Memory: About 0.59 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate storage.
  • High I/O Density: 333 I/Os provide flexibility for interfacing with multiple peripherals, buses, and external components.
  • Compact BGA Footprint: 456-BBGA (456-FBGA, 23×23) package supports dense board layouts while retaining significant logic and I/O capacity.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C to align with general-purpose electronic applications.
  • Standards Compliance: RoHS compliance addresses environmental and materials considerations for many procurement requirements.

Why Choose XC3S1500-5FG456C?

The XC3S1500-5FG456C positions itself as a commercial-grade Spartan®-3 FPGA that combines nearly 30k logic elements, substantial on-chip RAM, and a high I/O count in a 456-ball BGA surface-mount package. Its electrical and thermal ratings—1.14 V to 1.26 V supply range and 0 °C to 85 °C operating temperature—make it suitable for a wide range of board-level designs requiring integrated programmable logic.

For engineers and procurement teams seeking a field-programmable solution with clear, verifiable capacity and package specifications, the XC3S1500-5FG456C offers scalable integration and RoHS compliance to support longer-term design lifecycles.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S1500-5FG456C and to discuss how this FPGA can meet your design requirements.

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