XC3S1500-5FGG320C

IC FPGA 221 I/O 320FBGA
Part Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 221 589824 29952 320-BGA

Quantity 999 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package320-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case320-BGANumber of I/O221Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3328Number of Logic Elements/Cells29952
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC3S1500-5FGG320C – Spartan®-3 FPGA, 320‑BGA

The XC3S1500-5FGG320C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD. It provides a balance of programmable logic, embedded memory, and a high I/O count in a compact 320‑BGA package, suitable for commercial-temperature designs.

Key on-chip resources include 3,328 CLBs and 29,952 logic cells, approximately 0.59 Mbits of embedded memory, and 221 user I/O pins. The device operates from a core supply range of 1.14 V to 1.26 V and is RoHS compliant.

Key Features

  • Programmable Logic  3,328 CLBs delivering 29,952 logic cells for implementing custom digital functions and state machines.
  • Embedded Memory  Total on-chip RAM of 589,824 bits (approximately 0.59 Mbits) to support buffering, FIFOs, and small data stores without external memory.
  • I/O Capacity  221 user I/O pins to connect peripherals, buses, and external interfaces directly to the FPGA fabric.
  • Gate Count  Approximately 1,500,000 gates of logic capacity for medium-complexity designs.
  • Package and Mounting  320‑BGA package (supplier package: 320‑FBGA, 19×19) suitable for surface-mount PCB assembly.
  • Power and Temperature  Core voltage supply range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Unique Advantages

  • High logic capacity: 29,952 logic cells and ~1.5M gates enable implementation of substantial digital functions without external processors.
  • On-chip memory reduces BOM: Approximately 0.59 Mbits of embedded RAM supports buffering and local data storage, minimizing the need for external memory components.
  • Extensive I/O: 221 I/O pins provide flexibility for interfacing to multiple peripherals and system buses from a single device.
  • Compact BGA footprint: 320‑BGA (320‑FBGA, 19×19) package offers a high pin count in a compact form factor for space-constrained PCBs.
  • Commercial temperature rating: Rated for 0 °C to 85 °C, aligning with a broad range of commercial electronic products.
  • RoHS compliant: Conforms to RoHS requirements for reduced environmental impact in manufacturing and end products.

Why Choose XC3S1500-5FGG320C?

The XC3S1500-5FGG320C delivers a balanced set of programmable resources—logic cells, CLBs, embedded RAM, and a large I/O count—packaged in a 320‑BGA suitable for commercial applications. Its specified core voltage range and RoHS compliance make it a straightforward choice for teams targeting commercial-temperature designs that need moderate to substantial programmable logic and on-chip memory.

This device is well suited to designers and procurement teams seeking a proven FPGA option with clear, verifiable specifications for logic capacity, memory, I/O, and packaging, offering long-term design stability and predictable integration into existing PCB assembly processes.

Request a quote or submit an inquiry for pricing and availability for the XC3S1500-5FGG320C.

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