XC3S1500-5FGG320C
| Part Description |
Spartan®-3 Field Programmable Gate Array (FPGA) IC 221 589824 29952 320-BGA |
|---|---|
| Quantity | 999 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 320-FBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 320-BGA | Number of I/O | 221 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3328 | Number of Logic Elements/Cells | 29952 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 589824 |
Overview of XC3S1500-5FGG320C – Spartan®-3 FPGA, 320‑BGA
The XC3S1500-5FGG320C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD. It provides a balance of programmable logic, embedded memory, and a high I/O count in a compact 320‑BGA package, suitable for commercial-temperature designs.
Key on-chip resources include 3,328 CLBs and 29,952 logic cells, approximately 0.59 Mbits of embedded memory, and 221 user I/O pins. The device operates from a core supply range of 1.14 V to 1.26 V and is RoHS compliant.
Key Features
- Programmable Logic 3,328 CLBs delivering 29,952 logic cells for implementing custom digital functions and state machines.
- Embedded Memory Total on-chip RAM of 589,824 bits (approximately 0.59 Mbits) to support buffering, FIFOs, and small data stores without external memory.
- I/O Capacity 221 user I/O pins to connect peripherals, buses, and external interfaces directly to the FPGA fabric.
- Gate Count Approximately 1,500,000 gates of logic capacity for medium-complexity designs.
- Package and Mounting 320‑BGA package (supplier package: 320‑FBGA, 19×19) suitable for surface-mount PCB assembly.
- Power and Temperature Core voltage supply range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant.
Unique Advantages
- High logic capacity: 29,952 logic cells and ~1.5M gates enable implementation of substantial digital functions without external processors.
- On-chip memory reduces BOM: Approximately 0.59 Mbits of embedded RAM supports buffering and local data storage, minimizing the need for external memory components.
- Extensive I/O: 221 I/O pins provide flexibility for interfacing to multiple peripherals and system buses from a single device.
- Compact BGA footprint: 320‑BGA (320‑FBGA, 19×19) package offers a high pin count in a compact form factor for space-constrained PCBs.
- Commercial temperature rating: Rated for 0 °C to 85 °C, aligning with a broad range of commercial electronic products.
- RoHS compliant: Conforms to RoHS requirements for reduced environmental impact in manufacturing and end products.
Why Choose XC3S1500-5FGG320C?
The XC3S1500-5FGG320C delivers a balanced set of programmable resources—logic cells, CLBs, embedded RAM, and a large I/O count—packaged in a 320‑BGA suitable for commercial applications. Its specified core voltage range and RoHS compliance make it a straightforward choice for teams targeting commercial-temperature designs that need moderate to substantial programmable logic and on-chip memory.
This device is well suited to designers and procurement teams seeking a proven FPGA option with clear, verifiable specifications for logic capacity, memory, I/O, and packaging, offering long-term design stability and predictable integration into existing PCB assembly processes.
Request a quote or submit an inquiry for pricing and availability for the XC3S1500-5FGG320C.

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