XC3S1500-5FGG456C

The XC3S1500-5FGG456C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD designed for configurable digital logic implementations. It combines a large logic resource set with significant embedded memory and a high I/O count in a compact ball-grid array package.

Key device characteristics include 3,328 configurable logic blocks (CLBs), 29,952 logic elements, approximately 0.59 Mbits of embedded memory (589,824 total RAM bits), and 333 I/O pins. The device is offered in a 456-ball BGA package (456-FBGA, 23×23), is RoHS compliant, and targets commercial temperature applications (0 °C to 85 °C) with a core supply range of 1.14 V to 1.26 V.

Key Features

• Logic Capacity  3,328 configurable logic blocks (CLBs) and 29,952 logic elements provide substantial on-chip programmable logic for medium- to high-density designs.
• Embedded Memory  Approximately 0.59 Mbits of total on-chip RAM (589,824 bits) for buffering, state storage, and local data processing.
• I/O Resources  333 I/O pins support a wide range of external interfaces and parallel connections, enabling flexible system integration.
• Gate Density  A device-level gate count of 1,500,000 supports complex logic and control functions within a single FPGA package.
• Package and Mounting  456-ball BGA (456-FBGA, 23×23) package in a surface-mount form factor delivers a compact footprint for board-level integration.
• Power and Thermal  Core supply range of 1.14 V to 1.26 V with commercial-grade operating temperature from 0 °C to 85 °C.
• Regulatory  RoHS compliant, meeting common environmental material requirements for commercial electronics.
• Grade  Commercial grade device suitable for a wide range of non-automotive, non-industrial applications.

Typical Applications

• High-density logic implementations  Use where substantial programmable logic capacity and gate count are needed to implement complex digital functions on a single device.
• I/O-intensive designs  Ideal for systems that require a large number of external connections, leveraging the 333 available I/O pins for parallel interfaces and external peripherals.
• Embedded memory buffering  On-chip RAM (approximately 0.59 Mbits) supports local data buffering and state storage for control and data-path logic.

Unique Advantages

• High on-chip logic and gate density  Reduces the need for multiple discrete logic devices by consolidating complex functions into a single FPGA.
• Substantial I/O capacity  333 I/O pins enable flexible connectivity to external peripherals and parallel interfaces without external expanders.
• Compact BGA packaging  456-ball BGA (23×23) provides a high pin-count in a compact footprint for space-constrained board designs.
• Integrated on-chip memory  Approximately 0.59 Mbits of RAM supports localized buffering and decreases dependence on external memory for many control and data-path tasks.
• Commercial temperature and RoHS compliance  Commercial operating range (0 °C to 85 °C) and RoHS conformity support mainstream electronic product requirements.

Why Choose XC3S1500-5FGG456C?

The XC3S1500-5FGG456C positions itself as a capable, commercial-grade Spartan®-3 FPGA that balances sizable logic resources, embedded memory, and high I/O capacity in a single, compact BGA package. Its combination of 3,328 CLBs, nearly 30k logic elements, and approximately 0.59 Mbits of RAM makes it suitable for designs that need consolidated programmable logic and significant on-chip resources.

Engineers and procurement teams seeking a RoHS-compliant, surface-mount FPGA with a 456-ball BGA footprint and a defined commercial temperature range will find this device aligned with medium- to high-density digital designs that require robust I/O and local memory. The clear supply voltage and package specifications simplify integration into board-level designs where those parameters are required.

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