XC3S1500L-4FGG320C

The XC3S1500L-4FGG320C is a commercial-grade Spartan®-3L field programmable gate array (FPGA) from AMD. It integrates a high number of logic resources, on-chip memory, and I/O in a compact 320-BGA package for surface-mount assembly.

Designed for general-purpose programmable logic in commercial applications, this device provides a balance of integration and flexibility for embedded designs that require substantial logic density and a large I/O count within a single package.

Key Features

• Core and Logic 2,816 configurable logic blocks (CLBs) providing 29,952 logic elements and an equivalent of 1,500,000 gates for implementing complex digital designs.
• Embedded Memory Approximately 0.59 Mbits of on-chip RAM (589,824 total RAM bits) to support buffering, state machines, and data storage without external memory.
• I/O and Integration 221 user I/O pins to support a variety of external interfaces and parallel/serial connectivity needs.
• Supply Voltage Core supply range of 1.14 V to 1.26 V, enabling standard low-voltage FPGA core operation.
• Package and Mounting 320-BGA (supplier package: 320-FBGA, 19 × 19) in a surface-mount form factor for compact board-level integration.
• Operating Range and Grade Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance RoHS compliant.

Typical Applications

• Digital Prototyping and FPGA-based Development — High logic density and abundant I/O make the device suitable for implementing custom digital functions and validating hardware designs.
• Embedded Control and Interface Logic — On-chip RAM and large I/O count support control tasks, protocol bridging, and peripheral interfacing in commercial products.
• Signal Processing and Acceleration — Significant logic resources and embedded memory enable partitioning of compute and buffering tasks for application-specific acceleration.

Unique Advantages

• High integration density: Nearly 30k logic elements and 2,816 CLBs reduce the need for external gate arrays and discrete logic, simplifying board design.
• Substantial on-chip memory: Approximately 0.59 Mbits of embedded RAM supports internal buffering and state storage without adding external memory components.
• Large I/O resource: 221 I/O pins provide flexible connectivity options for interfacing with peripherals, sensors, or external buses.
• Compact BGA package: 320-BGA (320-FBGA, 19×19) allows high-density integration while maintaining surface-mount manufacturability.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial product environments.
• Standards-based environmental compliance: RoHS compliance supports modern electronics manufacturing and regulatory requirements.

Why Choose XC3S1500L-4FGG320C?

The XC3S1500L-4FGG320C positions itself as a versatile, commercial-grade FPGA option for engineers who need substantial logic capacity, on-chip memory, and a large I/O complement in a compact BGA package. Its combination of CLBs, logic elements, and embedded RAM supports a range of programmable logic tasks while keeping board-level component count low.

This device is suited for teams developing commercial embedded systems, digital prototyping platforms, and application-specific acceleration where integration, predictable operating conditions (0 °C to 85 °C), and RoHS compliance are important considerations.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S1500L-4FGG320C. Technical and purchasing teams can provide lead-time and ordering details on request.