XC3S1600E-4FG320C

The XC3S1600E-4FG320C is a Spartan®-3E field programmable gate array (FPGA) IC by AMD, delivered in a 320‑ball BGA package. It provides a programmable logic platform with 33,192 logic elements and approximately 0.66 Mbits of embedded memory for implementing custom digital functions.

With 250 user I/O pins, a nominal core supply range of 1.14 V to 1.26 V, and a commercial operating temperature range of 0 °C to 85 °C, this device is intended for commercial electronic designs that require significant on-chip logic capacity, embedded RAM, and moderate I/O density.

Key Features

• Logic Capacity — 33,192 logic elements enable implementation of complex custom logic and state machines.
• Embedded Memory — Approximately 0.66 Mbits of on-chip RAM for temporary data storage, buffering, and small lookup tables.
• I/O Resources — 250 user I/O pins provide broad interfacing options for peripherals, buses, and sensors.
• Gate Count — Device contains 1,600,000 gates, reflecting available combinational and sequential resources.
• Power — Core voltage supply range of 1.14 V to 1.26 V supports predictable power budgeting for the FPGA core.
• Package & Mounting — 320‑BGA (supplier package: 320‑FBGA 19×19) in a surface‑mount format for compact PCB layouts.
• Temperature Rating — Commercial grade operation from 0 °C to 85 °C for mainstream electronics.
• RoHS Compliance — Device is RoHS compliant for environmental and regulatory considerations.

Typical Applications

• Embedded Systems — Implement glue logic, protocol bridges, and custom processing blocks using the device's logic elements and embedded memory.
• I/O‑Intensive Designs — Leverage 250 user I/O pins to interface multiple peripherals, sensors, or bus systems on a single FPGA.
• Digital Prototyping — Use the programmable fabric and substantial gate/logic resources to prototype complex digital designs before ASIC migration.
• Custom Control and Timing — Deploy finite-state machines, sequencers, and timing logic that benefit from on-chip RAM and abundant logic elements.

Unique Advantages

• Substantial On‑Chip Logic: 33,192 logic elements provide headroom for sizable custom logic implementations without external ASICs.
• Integrated Memory Resources: Approximately 0.66 Mbits of embedded RAM reduce the need for some external memory components and simplify board design.
• High I/O Count: 250 user I/O pins support multiple interfaces and sensor connections, minimizing external multiplexing.
• Compact BGA Package: 320‑BGA surface‑mount packaging saves board area while maintaining a high pin count for dense designs.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for mainstream commercial product deployments.
• RoHS Compliant: Conforms to environmental compliance expectations for commercial electronics manufacturing.

Why Choose XC3S1600E-4FG320C?

The XC3S1600E-4FG320C delivers a balanced combination of logic density, embedded memory, and I/O resources in a compact 320‑BGA package for commercial electronic designs. Its specified core voltage range and commercial temperature rating make it suitable for a wide range of mainstream applications that require programmable logic and on‑chip storage.

This device is well suited for engineers building mid‑scale programmable logic solutions—offering room for complex custom logic, on‑chip RAM for buffering and state storage, and ample I/O for system integration—while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry to receive pricing and availability information for the XC3S1600E-4FG320C. Our team will respond with details to help you move your design forward.