XC3S1500-5FGG676C

The XC3S1500-5FGG676C is a Spartan®-3 FPGA designed for programmable-logic implementations in commercial electronic systems. It integrates substantial logic capacity, on-chip memory, and a high I/O count to support complex digital designs that require flexible hardware implementation.

This device provides 29,952 logic elements, approximately 0.59 Mbits of embedded memory (589,824 bits), and 487 user I/O in a compact 676-ball BGA package, while operating within a 1.14 V to 1.26 V supply window and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  29,952 logic elements and an estimated 1,500,000 gates enable complex combinational and sequential logic implementations.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (589,824 bits) for buffering, state storage, and small data structures directly within the FPGA fabric.
• I/O Density  487 user I/O pins provide broad interfacing capability for parallel buses, control signals, and multi-channel connectivity.
• Package and Mounting  676-BGA package (supplier package: 676-FBGA, 27 × 27 mm) with surface-mount construction for high-density PCB integration.
• Power Supply  Core voltage supply range from 1.14 V to 1.26 V, suitable for designs targeting this nominal supply window.
• Operating Range and Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant to meet environmental and regulatory requirements for lead-free assembly.

Unique Advantages

• Substantial Logic Capacity: Nearly 30k logic elements allow implementation of sizable custom logic blocks and moderate complexity IP cores within a single device.
• On-Chip Memory for Efficient Data Handling: Approximately 0.59 Mbits of embedded RAM minimizes external memory dependencies for buffering and state retention.
• High I/O Count: 487 I/O pins support dense peripheral connections and multi-channel interfaces without immediate need for external expanders.
• Compact BGA Footprint: 676-ball FBGA (27 × 27 mm) enables high-density PCB layouts while keeping signal routing concentrated for complex designs.
• Commercial Temperature and RoHS Compliance: Designed for standard commercial environments and compliant with RoHS requirements for lead-free manufacturing.

Why Choose XC3S1500-5FGG676C?

The XC3S1500-5FGG676C positions itself as a flexible, commercially graded FPGA option for designers who need significant on-chip logic, embedded RAM, and a high number of I/O signals in a compact BGA package. Its combination of nearly 30k logic elements, approximately 0.59 Mbits of embedded memory, and 487 I/O pins offers a balanced platform for consolidating digital functions and reducing board-level complexity.

This device is suitable for teams and projects that require a reliable, RoHS-compliant FPGA solution within a defined commercial temperature range and a narrow core-voltage window, providing predictable integration and deployment in a variety of electronic systems.

Request a quote or submit a pricing and availability inquiry to evaluate XC3S1500-5FGG676C for your next design.