XC3S1500-5FG676C

The XC3S1500-5FG676C is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD supplied in a 676-ball BGA package. It integrates high logic capacity and on-chip memory with a broad I/O count, suitable for designs that require substantial programmable logic and connectivity within a compact surface-mount package.

Key architectural attributes include 3,328 configurable logic blocks delivering 29,952 logic elements, approximately 0.59 Mbits of embedded RAM, and up to 487 I/O pins. The device operates from a 1.14 V to 1.26 V core supply and is specified for commercial temperature ranges.

Key Features

• Core Logic — 3,328 configurable logic blocks providing 29,952 logic elements, enabling implementation of complex custom logic and state machines.
• Embedded Memory — Total on-chip RAM of 589,824 bits, approximately 0.59 Mbits of embedded memory for buffering, look-up tables and small data stores.
• I/O Capacity — Up to 487 I/O pins to support wide interfacing and multiple peripheral connections in a single device.
• Gate Count — Equivalent to 1,500,000 gates for mapping large-scale logic functions and glue logic integration.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match system power architecture requirements.
• Package & Mounting — 676-ball FBGA (27 × 27) package, surface-mount mounting type for high-density PCB layouts.
• Operating Grade — Commercial temperature range specified from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant, aligning with lead-free assembly requirements.

Unique Advantages

• High logic density: Nearly 30k logic elements provide the capacity to consolidate multiple discrete functions into a single programmable device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 0.59 Mbits of embedded RAM supports local buffering and data manipulation without external memory.
• Large I/O resource: 487 I/O pins enable broad peripheral connectivity and flexible system partitioning.
• Compact BGA footprint: The 676-FBGA (27×27) package delivers high pin count in a compact form factor suitable for dense PCB designs.
• Low-voltage core operation: 1.14 V–1.26 V supply supports integration into modern low-voltage power domains.
• RoHS-compliant commercial grade: Meets lead-free manufacturing requirements and is specified for standard commercial temperature operation.

Why Choose XC3S1500-5FG676C?

The XC3S1500-5FG676C positions itself as a versatile, mid-range Spartan®-3 FPGA option that balances logic capacity, embedded memory, and a high I/O count in a single 676-ball FBGA package. Its combination of nearly 30k logic elements, approximately 0.59 Mbits of on-chip RAM, and up to 487 I/O make it suitable for customers seeking to reduce component count and simplify system design while maintaining flexibility.

Designed for commercial-grade applications, this device offers a practical mix of performance and integration for engineers developing complex digital systems that require significant programmable logic, local memory, and extensive interfacing, all within a compact surface-mount package.

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