XC3S1500L-4FGG456C

The XC3S1500L-4FGG456C is a Spartan®-3L Field Programmable Gate Array (FPGA) manufactured by AMD, delivered in a 456-BBGA package. It provides up to 29,952 logic elements, approximately 0.59 Mbits of embedded memory, and 333 user I/Os in a surface-mount FBGA footprint for commercial-temperature designs.

Key Features

• FPGA Core Spartan®-3L FPGA architecture implemented in the XC3S1500L-4FGG456C part for programmable digital logic integration.
• Logic Resources 29,952 logic elements (cells) supporting complex custom logic and state machines, with a total gate count of 1,500,000.
• Embedded Memory Total on-chip RAM of 589,824 bits — approximately 0.59 Mbits of embedded memory for buffering and local storage.
• I/O Density 333 user I/Os to interface with external devices, peripherals, and buses.
• Package & Mounting 456-ball BBGA package (supplier device package: 456-FBGA, 23×23) supplied in a surface-mount form factor suited for compact board layouts.
• Power Core voltage supply range of 1.14 V to 1.26 V for the programmable logic core.
• Operating Range & Grade Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Unique Advantages

• Substantial on-chip logic: 29,952 logic elements and 1,500,000 gates provide a high level of integration for implementing substantial digital functions on a single device.
• Significant embedded memory: Approximately 0.59 Mbits of on-chip RAM enables local buffering and state storage without immediate dependence on external memory.
• High I/O count: 333 I/Os support dense peripheral and bus interfacing from a single FPGA device.
• Compact FBGA package: 456-ball BBGA/456-FBGA (23×23) package offers a space-efficient mounting option for systems with routing and board-area constraints.
• Low-voltage core: Narrow core supply range (1.14 V to 1.26 V) simplifies power-supply selection for the FPGA core domain.
• Commercial grade and RoHS compliant: Designed for commercial-temperature operation (0 °C to 85 °C) and meets RoHS requirements.

Why Choose XC3S1500L-4FGG456C?

The XC3S1500L-4FGG456C delivers a balance of programmable logic capacity, embedded memory, and high I/O density in a compact 456-BBGA surface-mount package. Its resource set—29,952 logic elements, approximately 0.59 Mbits of RAM and 333 I/Os—makes it suitable for designers who need substantial on-chip integration within commercial-temperature systems. Manufactured by AMD and RoHS compliant, it supports designs that require a well-defined set of on-chip resources and a compact package footprint.

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