XC3S1600E-4FG400C

The XC3S1600E-4FG400C is a commercial-grade Field Programmable Gate Array (FPGA) from AMD's Spartan-3E family. It provides reconfigurable logic capacity and on-chip resources in a 400-ball BGA package for use in commercial embedded systems and general-purpose programmable-logic applications.

With a substantial count of logic elements, significant embedded memory, and a high number of I/Os, this device is suited for designs that require integrated programmable logic, moderate on-chip RAM, and dense I/O connectivity while operating within standard commercial temperature and supply ranges.

Key Features

• Logic Capacity — 33,192 logic elements provide the programmable fabric required for medium- to high-density logic implementations and custom hardware functions.
• Embedded Memory — Approximately 0.66 Mbits of on-chip RAM (663,552 total RAM bits) to support buffering, FIFOs, and distributed memory needs without external memory for many use cases.
• I/O and Gate Count — 304 dedicated I/O pins and 1,600,000 gates enable dense peripheral interfacing and substantial combinational/sequential logic integration.
• Package and Mounting — 400-ball BGA package in a 400-FBGA (21×21) supplier footprint, designed for surface-mount PCB assembly.
• Power Supply — Core supply operating in the 1.14 V to 1.26 V range to match system power rails and design constraints.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C to meet standard commercial environmental requirements.
• RoHS Compliant — Device conforms to RoHS requirements for lead-free manufacturing processes.

Typical Applications

• Commercial Embedded Systems — Use the FPGA for custom logic acceleration, protocol conversion, or glue-logic tasks in commercial electronic products.
• High-Density I/O Interfaces — Leverage 304 I/O pins for multi-channel sensor interfaces, communication endpoints, or peripheral aggregation.
• Memory-Backed Logic — Employ the embedded ~0.66 Mbits of RAM for buffering, FIFOs, and temporary data storage in streaming or packet-processing applications.
• Prototyping and Development — Implement complex digital functions and iterate designs using the device's substantial logic element count and on-chip resources.

Unique Advantages

• Substantial Logic Density: 33,192 logic elements enable integration of multiple functional blocks on a single device, reducing external component count.
• Integrated Memory Resources: Approximately 0.66 Mbits of embedded RAM reduce dependence on external memory for many buffering and temporary storage needs.
• High I/O Count: 304 I/O pins support dense connectivity to peripherals, sensors, and communication interfaces without additional I/O expanders.
• Compact BGA Footprint: 400-FBGA (21×21) packaging delivers high integration in a surface-mount form factor suitable for space-constrained PCBs.
• Commercial Operating Range: 0 °C to 85 °C rating and RoHS compliance align the part with standard commercial product lifecycles and manufacturing practices.

Why Choose XC3S1600E-4FG400C?

The XC3S1600E-4FG400C balances significant programmable logic capacity, on-chip RAM, and a high I/O count in a compact 400-BGA package, making it a practical choice for commercial embedded applications that require integrated hardware flexibility. Its power and temperature specifications suit standard commercial designs, while RoHS compliance supports contemporary manufacturing requirements.

This device is appropriate for engineering teams building systems that need medium- to high-density reconfigurable logic with ample I/O and modest embedded memory—providing a scalable solution for a range of programmable-logic tasks within commercial environments.

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