XC3S1600E-4FGG320C

The XC3S1600E-4FGG320C is a Spartan®-3E field programmable gate array (FPGA) designed for configurable digital logic integration. It delivers a combination of logic capacity, embedded RAM, and I/O density in a compact 320-ball BGA package targeted at commercial temperature applications.

Key Features

• Logic Capacity — 33,192 logic elements provide substantial on-chip programmable logic resources for implementing custom digital functions.
• Embedded Memory — Approximately 0.66 Mbits of on-chip RAM (663,552 total RAM bits) for buffering, FIFOs, and small data stores directly in the FPGA fabric.
• I/O Density — 250 user I/O pins support a wide variety of external interfaces and signal connections.
• Gate Equivalent — Equivalent to 1,600,000 gates of logic capacity for medium-scale integration tasks.
• Power — Core supply voltage range from 1.14 V to 1.26 V to match system power-rail requirements.
• Package & Mounting — Supplied in a 320-BGA (320-FBGA, 19×19) package and intended for surface-mount assembly, enabling compact board layouts.
• Operating Range & Grade — Commercial grade operation over 0 °C to 85 °C for standard commercial applications.
• Regulatory — RoHS compliant, supporting lead-free assembly and environmental requirements.

Typical Applications

• Custom Digital Logic — Implement glue logic, state machines, and protocol adaptation using on-chip logic elements and programmable routing.
• Embedded System Integration — Provide configurable peripheral interfaces and custom I/O handling with 250 I/O pins for system-level connectivity.
• Memory Buffering and Data Handling — Use the on-chip RAM for FIFOs, small data buffers, and temporary storage in data-path designs.

Unique Advantages

• Substantial Logic Resources: 33,192 logic elements enable implementation of complex custom functions without external logic.
• Integrated On-Chip Memory: Approximately 0.66 Mbits of embedded RAM reduces the need for external memory in many buffering and control applications.
• High I/O Count: 250 user I/Os simplify board-level connectivity and support multiple peripheral interfaces directly from the FPGA.
• Compact Surface-Mount Package: 320-BGA (19×19) provides a dense footprint that supports compact PCB designs.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C to match standard commercial deployment requirements.
• RoHS Compliant: Supports lead-free manufacturing processes and environmental regulatory considerations.

Why Choose XC3S1600E-4FGG320C?

The XC3S1600E-4FGG320C positions itself as a balanced FPGA solution combining sizable logic capacity, embedded RAM, and a high I/O count in a compact 320-BGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of standard commercial embedded designs where board space and integration are priorities.

Manufactured by AMD and equipped with a low-voltage core supply range, this part is appropriate for designers seeking a configurable, mid-density FPGA platform that supports consolidated logic functions, on-chip data buffering, and flexible interfacing in surface-mount form factors.

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