XC3S1600E-4FGG400C

The XC3S1600E-4FGG400C is a Spartan®-3E field programmable gate array (FPGA) IC from AMD supplied in a 400-ball BGA package. It provides a mid-range logic density and on-chip memory footprint suitable for custom digital logic, protocol bridging, and I/O-rich designs.

Key attributes include approximately 33,192 logic elements, roughly 0.66 Mbits of embedded memory, up to 304 I/O pins, and a 1.14–1.26 V core supply range. The device is RoHS compliant and rated for commercial temperature operation.

Key Features

• Logic Density Approximately 33,192 logic elements (about 1,600,000 gates) for implementing complex combinational and sequential logic.
• Embedded Memory Approximately 0.66 Mbits of on-chip RAM suitable for buffering, FIFOs, and small lookup tables.
• I/O Capacity Up to 304 user I/O pins to support multiple parallel interfaces, sensors, and peripheral connections.
• Power and Core Supply Narrow core voltage range of 1.14 V to 1.26 V for the FPGA core supply.
• Package and Mounting 400-ball FBGA (21 × 21) surface-mount package for compact board-level integration.
• Operating Range & Compliance Commercial temperature rating (0 °C to 85 °C) and RoHS compliance for standard electronics applications.

Typical Applications

• Custom digital logic and acceleration – Implement hardware-accelerated data paths and protocol converters using the available logic element capacity.
• Interface aggregation and bridging – Use the 304 I/O pins to connect and translate between multiple parallel or serial interfaces.
• Buffering and packet handling – Leverage the on-chip memory for packet buffering, small FIFOs, and temporary storage in communication systems.
• Embedded system glue logic – Integrate control, timing, and peripheral management functions on a single programmable device.

Unique Advantages

• Balanced logic-to-memory ratio: The combination of ~33k logic elements and ~0.66 Mbits of RAM supports mixed logic and storage tasks without external memory for small-to-medium designs.
• High I/O count: With up to 304 I/Os, the device simplifies board-level routing for multi-interface systems and reduces the need for external multiplexing.
• Compact BGA footprint: The 400-FBGA (21×21) package enables a dense board layout while maintaining a large number of signals and internal resources.
• Commercial temperature suitability: Rated 0 °C to 85 °C for a wide range of standard electronics and consumer applications.
• Standards-compliant supply: Core voltage specified at 1.14–1.26 V for straightforward power-supply planning.
• RoHS compliant: Conforms to RoHS requirements for lead-free assembly and regulatory compatibility in many global markets.

Why Choose XC3S1600E-4FGG400C?

The XC3S1600E-4FGG400C positions itself as a practical FPGA choice for designs that require a mid-range mix of logic density, on-chip memory, and extensive I/O in a compact BGA package. Its combination of approximately 33,192 logic elements, roughly 0.66 Mbits of embedded RAM, and 304 I/Os makes it well suited for communications, control, and embedded processing tasks where consolidation of functions onto a single programmable device reduces BOM and increases design flexibility.

This commercial-grade, RoHS-compliant FPGA is appropriate for engineering and procurement teams looking for a field-programmable solution that balances integration, board-level density, and straightforward power requirements. The device supports scalable development paths where programmable logic enables iterative feature updates and in-field reconfiguration.

Request a quote or submit an inquiry to check availability and pricing for the XC3S1600E-4FGG400C and to discuss how it can fit your next design.