XC3S1600E-4FGG320I

The XC3S1600E-4FGG320I is a Spartan®-3E field programmable gate array (FPGA) in a 320-ball BGA package designed for industrial-grade embedded logic applications. It integrates a sizable logic fabric, on-chip memory, and a broad I/O complement to support custom digital processing, interfacing, and control functions.

Key attributes include 3,688 CLBs (33,192 logic elements), approximately 0.664 Mbits of embedded memory, 250 user I/Os, and an operating temperature range from −40 °C to 100 °C, making it suitable for demanding environments where reprogrammable logic and reliability are required.

Key Features

• Core Logic  3,688 CLBs providing 33,192 logic elements for implementing custom digital logic, state machines, and parallel processing blocks.
• On-Chip Memory  Approximately 0.664 Mbits (663,552 bits) of embedded RAM to support buffers, FIFOs, and distributed memory structures.
• I/O and Gate Density  250 user I/O pins and a logic-equivalent gate count of 1,600,000 to enable extensive peripheral interfacing and complex designs.
• Power  Core voltage supply range of 1.14 V to 1.26 V for the FPGA core.
• Package and Mounting  320-ball BGA package (supplier device package: 320-FBGA, 19 × 19) with surface-mount mounting for high-density board designs.
• Environment and Reliability  Industrial grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance for regulatory compatibility.

Typical Applications

• Industrial Control  Implement control logic, custom interfaces, and signal processing with the device’s CLB and I/O resources for factory automation and machine control.
• Embedded Processing  Use on-chip RAM and abundant logic elements to implement embedded accelerators, protocol bridges, or peripheral controllers.
• High-Density I/O Systems  Leverage 250 user I/Os and the 320-BGA package for complex sensor, actuator, and communications front-ends requiring many signals.

Unique Advantages

• Balanced Logic and Memory:  The combination of 33,192 logic elements and approximately 0.664 Mbits of embedded RAM supports mixed compute and buffering tasks without external memory for many applications.
• Substantial I/O Count:  250 user I/Os enable direct interfacing to a wide range of peripherals and bus architectures, reducing the need for external multiplexing.
• Industrial Temperature Range:  Rated from −40 °C to 100 °C to meet environmental demands typical of industrial deployments.
• Compact High-Density Package:  320-FBGA (19 × 19) package provides a small-footprint solution for board designs that require significant logic capacity in a compact area.
• RoHS Compliance:  Environmentally compliant manufacturing status simplifies regulatory considerations for system integrators.

Why Choose XC3S1600E-4FGG320I?

The XC3S1600E-4FGG320I positions itself as a versatile, industrial-grade FPGA that balances logic capacity, on-chip memory, and a broad I/O set in a compact BGA package. It is suited to engineers designing embedded systems that require reprogrammable logic, moderate embedded memory, and a high pin count within temperature-sensitive environments.

Its specification profile makes it appropriate for system designers who need scalability in logic implementation, reliable operation across industrial temperature ranges, and a platform that can be used for custom interfaces, digital control, and mid-density processing tasks.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead-time information for the XC3S1600E-4FGG320I. Our team can assist with your volume needs and technical questions.