XC3S1600E-4FGG484I

The XC3S1600E-4FGG484I is a Spartan®-3E family Field Programmable Gate Array (FPGA) offered in a 484-BBGA package. It provides a balanced combination of logic capacity, on-chip memory and I/O density for industrial-grade applications.

Designed for systems requiring substantial programmable logic, the device features 33,192 logic elements, approximately 0.664 Mbits of embedded memory (663,552 total RAM bits), and 376 I/O pins, while operating across a 1.14 V to 1.26 V core supply range and an industrial temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity  33,192 logic elements with 3,688 configurable logic blocks (CLBs), enabling implementation of complex digital functions.
• Embedded Memory  Approximately 0.664 Mbits of on-chip RAM (663,552 total RAM bits) to support buffering, lookup tables and state storage.
• I/O Density  376 I/O pins provide extensive external interface options for connectivity and system integration.
• Gate Count  Equivalent to 1,600,000 gates for substantial design scale and integration.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power domains.
• Package  484-ball BBGA (484-FBGA, 23×23) surface-mount package for compact board-level integration.
• Industrial Grade & Temperature Range  Specified operating range from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliance  Device is compliant with RoHS environmental requirements.

Unique Advantages

• High logic density: 33,192 logic elements provide headroom for complex logic and control tasks without immediate part changes.
• Substantial on-chip memory: Approximately 0.664 Mbits of RAM reduces dependency on external memory for many buffering and storage needs.
• Extensive I/O capability: 376 I/O pins support diverse peripheral connections and parallel interfaces directly from the FPGA.
• Industrial-ready thermal performance: Rated from −40 °C to 100 °C to meet the thermal demands of industrial deployments.
• Compact, manufacturable package: 484-BBGA surface-mount format supports high-density PCB layouts while maintaining robust solderability.
• Defined power domain: Narrow core voltage range (1.14 V–1.26 V) simplifies power provisioning and margin planning.

Why Choose XC3S1600E-4FGG484I?

The XC3S1600E-4FGG484I positions itself as a capable, industrial-grade FPGA option that combines significant logic resources, embedded memory and a high I/O count in a compact 484-BBGA package. Its specification set—33,192 logic elements, roughly 0.664 Mbits of on-chip RAM, 1.6 million gate equivalence and an operating range of −40 °C to 100 °C—makes it well suited to engineers building robust, scalable programmable logic solutions for demanding environments.

With RoHS compliance and a clearly defined power and package footprint, this FPGA is targeted at designs that require dependable integration and longevity. It is a practical choice for development teams and procurement focused on industrial applications that need substantial programmable resources in a single-component solution.

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