XC3S1600E-5FGG484C

The XC3S1600E-5FGG484C is a Spartan®-3E Field Programmable Gate Array (FPGA) IC manufactured by AMD, supplied in a 484-ball BGA package. It provides a balance of programmable logic capacity, embedded memory, and I/O density for commercial electronic designs.

Key on-chip resources include 33,192 logic elements, approximately 0.664 Mbits of embedded memory (663,552 bits), and 376 available I/Os. The device is specified for a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity 33,192 logic elements provide substantial programmable logic resources for implementing custom digital functions.
• Embedded Memory Approximately 0.664 Mbits of on-chip RAM (663,552 bits) for buffering, state storage, and small lookup tables.
• I/O and Gate Count 376 I/Os and an equivalent of 1,600,000 gates to support complex interfacing and system-level logic integration.
• Package and Mounting 484-BBGA package (484-FBGA, 23×23) with surface-mount mounting for compact board-level integration.
• Power Operates from a defined core supply range of 1.14 V to 1.26 V.
• Temperature and Grade Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance RoHS compliant.

Unique Advantages

• High logic density: 33,192 logic elements let you implement sizeable custom logic blocks on a single device, reducing external CPLD/ASIC needs.
• Integrated on-chip RAM: Approximately 0.664 Mbits of embedded memory supports buffering and local data storage without external memory.
• Extensive I/O availability: 376 I/Os provide flexibility for multi-channel interfacing and system expansion while minimizing additional I/O components.
• Compact BGA footprint: 484-BBGA (23×23) package enables dense board layouts and reliable soldering for production assemblies.
• Commercial temperature range: Rated 0 °C to 85 °C to meet typical commercial application environments.
• RoHS compliant: Meets common environmental requirements for lead-free assembly.

Why Choose XC3S1600E-5FGG484C?

The XC3S1600E-5FGG484C delivers a combination of substantial programmable logic, embedded memory, and a high I/O count in a compact 484-BBGA package. Its defined core voltage range and commercial operating temperature make it suitable for production designs that require predictable electrical and thermal characteristics.

Manufactured by AMD and provided as a RoHS-compliant, surface-mount FPGA, this device is appropriate for teams and projects that need a verified, commercially specified programmable logic solution with ample on-chip resources for integration and consolidation of digital functions.

Request a quote or submit an inquiry to receive pricing and availability information for the XC3S1600E-5FGG484C and to discuss how it fits your design requirements.