XC3S1600E-4FGG484C

The XC3S1600E-4FGG484C is a Spartan®-3E Field Programmable Gate Array (FPGA) IC from AMD. It delivers 33,192 logic elements, approximately 0.66 Mbits of embedded memory, and 376 user I/Os in a compact surface-mount BBGA package.

Targeted for commercial applications that need substantial on-chip logic, memory and I/O density, this device combines high logic capacity and a high pin count in a 484-ball BBGA (supplier package 484‑FBGA, 23×23) footprint.

Key Features

• Core Logic 33,192 logic elements and approximately 1,600,000 gates provide substantial programmable logic capacity for complex designs.
• On‑Chip Memory Approximately 0.66 Mbits (663,552 bits) of embedded RAM supports buffering, state storage and local data processing.
• I/O Density 376 user I/Os enable high pin-count interfacing without excessive external glue logic.
• Power Core supply operation between 1.14 V and 1.26 V for the device core.
• Package & Mounting 484-BBGA package (supplier device package: 484‑FBGA, 23×23) with surface-mount mounting for compact PCB integration.
• Operating Range & Grade Commercial grade device rated for 0 °C to 85 °C ambient operation.
• Compliance RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Custom digital logic and prototyping — Use the 33,192 logic elements and on-chip RAM to implement and iterate medium- to high-complexity digital designs and prototypes.
• I/O-intensive interface control — 376 I/Os provide the pin count needed for parallel interfaces, sensor arrays and multi-channel control signals.
• Embedded control and buffering — Approximately 0.66 Mbits of embedded memory supports local buffering and state retention for embedded control tasks.
• Space-constrained boards — The 484-BBGA surface-mount package enables high-density integration on compact PCBs.

Unique Advantages

• High logic capacity: 33,192 logic elements and 1.6 million gates enable implementation of substantial logic functions without external CPLDs.
• Significant embedded RAM: Approximately 0.66 Mbits of on-chip memory reduces dependence on external memory for buffering and temporary storage.
• Large native I/O count: 376 I/Os simplify board-level routing for feature-rich, multi-interface designs.
• Compact, surface-mount packaging: 484-BBGA / 484‑FBGA (23×23) keeps the PCB footprint small while preserving pin density.
• Low-voltage core operation: 1.14–1.26 V supply range supports low-voltage system architectures.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose XC3S1600E-4FGG484C?

The XC3S1600E-4FGG484C is positioned for designs that require a balance of high programmable logic density, meaningful on-chip RAM and a large I/O complement in a compact surface-mount package. Its combination of 33,192 logic elements, ~0.66 Mbits of embedded memory and 376 I/Os makes it well suited to commercial embedded systems, interface controllers and mid-range prototyping projects.

Engineers and procurement teams selecting this part gain a commercially rated FPGA option that supports space-constrained board layouts and low-voltage core domains while maintaining a high level of integration for streamlined BOM and board-level complexity.

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