XC3S1600E-5FGG320C

The XC3S1600E-5FGG320C is a Spartan®-3E field programmable gate array (FPGA) in a 320-ball BGA package. It provides mid-range programmable logic capacity with significant on-chip memory and a large number of general-purpose I/O pins for commercial embedded applications.

Key Features

• Logic Capacity — 33,192 logic elements supporting a design scale up to the device's 1,600,000 gate equivalence for complex combinational and sequential logic.
• Embedded Memory — Approximately 0.66 Mbits of on-chip RAM (663,552 bits) for buffering, lookup tables, and small data storage tasks.
• I/O Density — 250 general-purpose I/O pins suitable for interfacing with multiple peripherals and external logic.
• Package & Mounting — Surface-mount 320-BGA (supplier package: 320-FBGA, 19×19) for compact board-level integration.
• Power — Core voltage supply range of 1.14 V to 1.26 V.
• Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Prototyping and Development — Mid-range programmable logic resource for proving designs and validating custom digital functions before production.
• Embedded System Control — Implements control logic and interfacing tasks in commercial embedded products that require significant I/O and logic resources.
• Signal Processing and Data Handling — On-chip RAM and sizable logic fabric enable buffering, simple DSP pipelines, and data path customization.
• Interface Bridging — Suitable for implementing protocol bridges and glue logic between multiple digital subsystems thanks to its large I/O count.

Unique Advantages

• Substantial Logic Resources: 33,192 logic elements and a 1,600,000-gate equivalent enable implementation of complex custom logic without external ASICs.
• On-Chip Memory: Approximately 0.66 Mbits of embedded memory reduces the need for external RAM in many buffering and lookup applications.
• High I/O Count: 250 I/Os provide flexibility to connect multiple peripherals, sensors, and external interfaces directly to the FPGA.
• Compact BGA Package: 320-BGA (19×19) allows high-density board integration while maintaining a surface-mount footprint.
• Low-Voltage Core: Narrow supply range (1.14 V–1.26 V) supports designs optimized for that core-voltage window.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious product development.

Why Choose XC3S1600E-5FGG320C?

The XC3S1600E-5FGG320C is positioned for commercial embedded designs requiring a balance of logic density, on-chip memory, and substantial I/O capability in a compact surface-mount package. Its combination of approximately 33,192 logic elements, roughly 0.66 Mbits of embedded RAM, and 250 I/Os makes it a practical choice for mid-range custom logic, protocol bridging, and embedded control applications.

With a commercial operating range of 0 °C to 85 °C, RoHS compliance, and a 320-BGA package, this part offers a clear specification set for designers targeting compact, board-level FPGA integration.

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