XC3S200-4FT256C

The XC3S200-4FT256C is a Spartan®-3 field programmable gate array (FPGA) IC from AMD. It provides a moderate logic capacity and embedded memory footprint in a compact 256‑ball L‑BGA package for surface-mount assembly.

Designed for commercial-grade applications, this device offers a blend of programmable logic, I/O density and on-chip RAM suitable for control, glue-logic and custom digital functions where deterministic hardware logic and I/O integration are required.

Key Features

• Logic Capacity  Approximately 4,320 logic elements, enabling implementation of custom digital functions and control logic.
• Embedded Memory  Approximately 0.22 Mbits (221,184 bits) of on-chip RAM for buffering, state machines and small data storage.
• I/O Density  173 user I/O pins to support multiple external interfaces and signal aggregation.
• Gate Equivalent  Approximately 200,000 gates, providing a practical hardware resource set for mid-range designs.
• Package and Mounting  256‑LBGA (supplier package: 256‑FTBGA, 17×17) in a surface-mount form factor for space-efficient PCB layouts.
• Power  Core supply range of 1.14 V to 1.26 V to match system power rails and allow predictable power budgeting.
• Temperature and Grade  Commercial grade operation from 0 °C to 85 °C, suitable for standard commercial environments.
• RoHS Compliance  RoHS-compliant for regulatory and environmental considerations in commercial products.

Typical Applications

• Embedded Control  Use the device for on-board control logic where approximately 4,320 logic elements and 173 I/O pins provide sufficient resources for state machines and peripheral coordination.
• I/O Bridging and Glue Logic  Implement protocol bridging, signal conditioning and interface aggregation using the available I/O count and on-chip RAM for temporary buffering.
• Prototype and Development  Deploy the FPGA in development platforms to validate custom logic and system integration prior to production implementation.

Unique Advantages

• Right‑sized Logic Capacity: Approximately 4,320 logic elements deliver a balance of functionality without excessive cost or board area.
• Compact Surface‑Mount Package: 256‑LBGA in a 17×17 supplier package enables dense PCB placement and modern assembly flows.
• Generous I/O Count: 173 I/O pins allow direct connection to multiple peripherals and external devices, reducing the need for additional interface ICs.
• Integrated On‑chip Memory: Approximately 0.22 Mbits of RAM supports buffering and small data storage inside the FPGA, simplifying external memory requirements.
• Commercial Temperature Range: Rated 0 °C to 85 °C for reliable performance in standard commercial environments.
• Vendor Backing: Manufactured by AMD as part of the Spartan®-3 family, offering access to established documentation and reference materials.

Why Choose XC3S200-4FT256C?

The XC3S200-4FT256C positions itself as a practical, commercially graded FPGA solution for designs that require a moderate amount of programmable logic, substantial I/O, and embedded RAM in a compact surface‑mount package. Its combination of approximately 4,320 logic elements, 173 I/O pins and on-chip memory makes it well suited to control, interface and prototype applications where integration and predictable supply requirements matter.

Choose this FPGA when you need a vendor-backed, RoHS-compliant device that balances board space, logic capacity and I/O capability while operating within standard commercial temperature and supply ranges. Its package and resource mix support scalable designs and ease of integration into contemporary PCB assemblies.

Request a quote or submit an inquiry to receive pricing, availability and more information about integrating the XC3S200-4FT256C into your next design.