XC3S200-4FTG256C

The XC3S200-4FTG256C is an AMD Spartan®-3 FPGA offered in a 256-LBGA package. It provides a balanced combination of configurable logic, embedded RAM, and I/O count for commercial-grade programmable logic applications.

With 4,320 logic elements, approximately 0.221 Mbits of on‑chip RAM and 173 I/O pins, this device is suited to designs that require moderate logic density, local memory, and significant external connectivity while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Logic — 4,320 logic elements organized across 480 CLBs for implementing custom digital logic and control functions.
• Embedded Memory — Approximately 0.221 Mbits (221,184 bits) of on‑chip RAM to support buffering, state storage, and small data tables.
• I/O Capacity — 173 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Gate Count — Equivalent to 200,000 gates for overall logic capacity planning.
• Power — Core voltage supply range of 1.14 V to 1.26 V for the device core.
• Package & Mounting — 256‑LBGA package (supplier device package: 256‑FTBGA, 17×17) with surface-mount mounting for compact PCB integration.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• RoHS Compliance — Device is RoHS compliant for environmental and regulatory considerations.

Typical Applications

• General-purpose programmable logic — Implement custom digital functions and control logic using the device's 4,320 logic elements and 173 I/O pins.
• Data buffering and small memory tasks — Utilize the device's on‑chip RAM (221,184 bits) for local buffering, FIFOs, and state storage.
• I/O expansion and interfacing — Leverage the high I/O count for protocol bridging, peripheral aggregation, or signal conditioning front-ends.

Unique Advantages

• Balanced integration: Combines logic, embedded RAM, and a high I/O count in a single FPGA package to reduce board-level component count.
• Compact package footprint: 256‑LBGA (256‑FTBGA, 17×17) enables dense designs and efficient PCB placement.
• Low-voltage core operation: Core supply range of 1.14 V to 1.26 V supports low-voltage system architectures.
• Commercial temperature rating: Rated for 0 °C to 85 °C, appropriate for standard commercial applications and environments.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.
• AMD Spartan®-3 architecture: Familiar architecture naming and form factor for designers using Spartan®-3 devices.

Why Choose XC3S200-4FTG256C?

The XC3S200-4FTG256C targets designs that need a mid-range FPGA with a practical mix of logic density, on‑chip memory, and ample I/O in a compact 256‑LBGA footprint. Its 4,320 logic elements, 221,184 bits of embedded RAM, and 173 I/O pins make it suitable for configurable logic tasks, local buffering, and I/O-intensive functions within commercial temperature environments.

Choose this Spartan®-3 FPGA when you need a commercially graded, RoHS-compliant programmable device from AMD that integrates core logic, memory, and I/O capability for dependable, space-efficient PCB implementations.

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