XC3S200-4PQ208C

The XC3S200-4PQ208C is a Spartan®-3 field programmable gate array (FPGA) IC from AMD, packaged in a 208‑lead BFQFP. It provides a mid-range balance of logic capacity, on-chip RAM, and I/O count for commercial-grade electronic designs.

As a programmable logic device, it is suited for integrating custom digital functions directly into board-level systems where a defined logic capacity, specific I/O count, and commercial temperature range are required.

Key Features

• Core Architecture Field programmable gate array (FPGA) architecture for implementing custom digital logic.
• Logic Capacity 4,320 logic elements implemented across 480 CLBs to support moderate-complexity digital designs.
• On-Chip Memory Approximately 0.22 Mbits of embedded memory (221,184 bits) for data buffering, FIFOs, and state storage.
• I/O and Gate Count 141 user I/O pins and a gate equivalent of 200,000 provide flexible connectivity and gate-level capacity for glue logic and subsystem functions.
• Power Supply Range Supporting a core voltage supply range of 1.14 V to 1.26 V for defined power system integration.
• Package and Mounting 208‑lead BFQFP (supplier device package: 208‑PQFP, 28×28) in a surface-mount form factor for PCB assembly.
• Temperature and Grade Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Custom Digital Logic Implement board-level custom logic and state machines where defined logic element count and on-chip RAM are required.
• Interface and Glue Logic Provide protocol bridging and interface adaptation using the device's 141 I/O pins and programmable logic resources.
• Prototyping and Development Use the FPGA for functional prototyping of digital subsystems prior to final integration.

Unique Advantages

• Balanced Logic and Memory: 4,320 logic elements with ~0.22 Mbits of embedded RAM enable compact implementations without excessive external memory.
• Substantial I/O Count: 141 user I/Os allow flexible connectivity to peripherals, sensors, and buses on a single device.
• Defined Power Envelope: Narrow core supply range (1.14 V–1.26 V) simplifies power-supply design and integration.
• Surface-Mount BFQFP Package: 208‑lead BFQFP (28×28 PQFP footprint) supports high-density PCB layouts and automated assembly.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C environments suitable for general-purpose electronic products.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC3S200-4PQ208C?

The XC3S200-4PQ208C delivers a practical combination of logic elements, on-chip memory, and I/O density in a commercial-grade Spartan®-3 FPGA package. It is appropriate for designers who need a programmable solution to consolidate digital functions, reduce external component count, and maintain defined electrical and thermal operating parameters.

With clear packaging, RoHS compliance, and detailed device-level specifications, this FPGA is a solid option for development, prototyping, and deployment in electronic systems that match its commercial rating and supply requirements.

Request a quote or submit a purchase inquiry to receive pricing and lead-time information for the XC3S200-4PQ208C.