XC3S200-4PQ208I

The XC3S200-4PQ208I is an industrial-grade Spartan®-3 FPGA from AMD, supplied in a 208-BFQFP surface-mount package. It provides a balance of programmable logic, embedded memory, and I/O resources for industrial and embedded system designs.

With 4,320 logic elements, approximately 0.22 Mbits of on-chip RAM, and 141 user I/O pins, this device is suited for applications that require moderate logic capacity, on-chip memory, and substantial external interfacing while operating across a wide temperature and low-voltage range.

Key Features

• Logic Capacity — 4,320 logic elements to implement combinational and sequential logic in programmable hardware.
• Embedded Memory — Approximately 0.22 Mbits (221,184 bits) of on-chip RAM for buffering, state storage, and small data structures.
• I/O Density — 141 user I/O pins to support multiple external interfaces and peripheral connections.
• Gate Equivalent — Approximately 200,000 gates for estimating integration level with legacy gate-count metrics.
• Power — Core voltage supply range from 1.14 V to 1.26 V for low-voltage operation.
• Package & Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28) with surface-mount mounting for compact board-level integration.
• Industrial Temperature — Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control & Automation — Implement control logic, state machines, and I/O interfacing for machinery and process control using the device’s industrial temperature rating and multi-pin I/O.
• Embedded System Integration — Integrate custom peripherals, glue logic, and protocol handling where moderate logic density and on-chip memory are required.
• Prototyping & Development — Evaluate hardware architectures and iterate on designs that need a reprogrammable logic fabric with accessible I/O and embedded RAM.
• Data Aggregation & Interface Bridging — Aggregate signals from multiple sensors or peripherals and perform format conversion or buffering using the device’s I/O count and on-chip memory.

Unique Advantages

• Balanced logic and memory — 4,320 logic elements combined with ~0.22 Mbits of RAM provides a practical mix for control logic with local buffering needs.
• High I/O count — 141 user I/O pins support extensive external connectivity without requiring additional interface chips.
• Industrial-grade operation — Specified for −40 °C to 100 °C, enabling use in temperature-challenging installations.
• Low-voltage core — Core supply between 1.14 V and 1.26 V supports low-power system design considerations.
• Compact surface-mount package — 208-BFQFP (208-PQFP, 28×28) enables dense board layouts and standardized assembly processes.
• Regulatory compliance — RoHS compliance for environmentally conscious designs and manufacturing.

Why Choose XC3S200-4PQ208I?

The XC3S200-4PQ208I positions itself as a reliable, industrial-grade Spartan®-3 FPGA option where a moderate combination of logic, embedded memory, and substantial I/O is required. Its operating temperature range and surface-mount package make it suitable for robust embedded and industrial applications that demand reprogrammable logic and local memory resources.

Designers and procurement teams looking for a compact FPGA solution with clear power, temperature, and packaging specifications will find this device appropriate for prototyping and production systems that require field-programmable logic within defined industrial constraints.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S200-4PQ208I. Our team will respond with the information needed to move your design forward.