XC3S200-4TQ144I

The XC3S200-4TQ144I is an AMD Spartan®-3 field programmable gate array (FPGA) supplied in a 144-pin LQFP surface-mount package. It delivers 4,320 logic elements, approximately 0.221 Mbits of embedded memory, and 97 I/O for compact, programmable digital designs.

Targeted at industrial and embedded applications, this device combines mid-range logic capacity and on-chip memory with an industrial temperature rating and low-voltage core operation to address control, interface, and timing-centric designs.

Key Features

• Core Logic  4,320 logic elements (cells) and approximately 200,000 gates provide the programmable fabric for custom digital functions and state machines.
• Embedded Memory  Approximately 221,184 bits of on-chip RAM to support buffering, small data tables, and local state storage.
• I/O  97 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
• Power  Core voltage supply range of 1.14 V to 1.26 V for the device core power domain.
• Package & Mounting  144-LQFP (supplier package listed as 144-TQFP, 20×20) in a surface-mount form factor for compact PCB designs.
• Operating Range  Industrial-grade operating temperature from −40 °C to 100 °C for deployment in harsh or temperature-variable environments.
• Compliance  RoHS compliant material status for environmental and regulatory alignment.

Typical Applications

• Industrial Control  Implement customizable control logic, interface bridging, and timing functions in factory automation and machine control systems.
• Embedded Systems  Add programmable glue logic, peripheral aggregation, or protocol conversion in compact embedded products.
• Sensor and I/O Aggregation  Consolidate multiple sensor inputs and implement preprocessing, filtering, or simple decision logic close to the sensors.
• Prototyping and Custom Logic  Use as a development platform for finite-state machines, custom accelerators, or proof-of-concept digital designs.

Unique Advantages

• Balanced Logic Capacity: 4,320 logic elements and ~200,000 gates provide a mid-range programmable resource set suitable for many control and interface tasks without excessive board space.
• On-Chip Memory: Approximately 0.221 Mbits of embedded RAM supports local buffering and small lookup tables, reducing external memory needs.
• Generous I/O Count: 97 I/O pins enable direct connections to multiple peripherals, sensors, and external devices, simplifying PCB routing.
• Industrial Temperature Rating: Specified operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact Surface-Mount Package: 144-LQFP surface-mount package (144-TQFP, 20×20 supplier designation) allows dense PCB layouts while maintaining accessibility for programming and debugging.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious designs and regulatory alignment.

Why Choose XC3S200-4TQ144I?

The XC3S200-4TQ144I positions itself as a practical, industrial-grade FPGA option for engineers needing a compact, mid-capacity programmable device. With 4,320 logic elements, approximately 221 kb of embedded memory, and 97 I/Os, it fits designs that require local processing, interface consolidation, and configurable logic without large form-factor impacts.

Its surface-mount 144-LQFP package, controlled core voltage range, and wide operating temperature make it suitable for embedded and industrial projects where space, reliability, and predictable electrical characteristics matter. The device offers a straightforward balance of logic, memory, and I/O for teams aiming to reduce BOM complexity and accelerate time-to-market with programmable hardware.

Request a quote or submit a product inquiry to check pricing and availability for the XC3S200-4TQ144I and to discuss how it can fit your next embedded or industrial design.