XC3S200-4VQ100I

The XC3S200-4VQ100I is a Spartan®-3 Field Programmable Gate Array (FPGA) offered by AMD. It provides a moderate logic capacity and on-chip RAM in a compact surface-mount TQFP package, targeted for industrial applications where temperature range and board-level integration matter.

With 4,320 logic elements, approximately 0.22 Mbits of embedded memory and 63 I/O, this device is suited to designs that require configurable logic, on-chip storage, and a robust operating temperature range.

Key Features

• Core Logic: 4,320 logic elements enabling configurable digital logic implementation and moderate gate density (200,000 gates).
• Embedded Memory: Approximately 0.22 Mbits of on-chip RAM (221,184 total RAM bits) for data buffering, state storage, and small lookup tables.
• I/O Capacity: 63 I/O pins to support a variety of peripheral interfaces and board-level signal routing without external glue logic.
• Power Supply: Operates from a low-voltage core supply range of 1.14 V to 1.26 V, suitable for low-voltage FPGA cores.
• Package & Mounting: Available in a 100-TQFP surface-mount package (supplier device package: 100-VQFP, 14×14), enabling compact PCB layouts.
• Industrial Temperature Range: Rated for operation from −40°C to 100°C for deployment in industrial environments.
• Regulatory Compliance: RoHS compliant to meet common environmental requirements.

Typical Applications

• Industrial Control & Automation: Provides configurable logic and on-chip RAM for control algorithms, signal conditioning, and interface handling in industrial systems operating across a wide temperature range.
• Embedded System Prototyping: Offers sufficient logic elements and I/O to implement and validate custom logic blocks, data paths, and peripheral interfaces during development.
• Interface Bridging & Glue Logic: With 63 I/O pins and moderate gate density, the FPGA can consolidate discrete interface logic and reduce component count on board-level designs.

Unique Advantages

• Moderate Logic Density: 4,320 logic elements provide a balance between capability and resource efficiency for mid-sized digital designs.
• On-Chip Memory: Approximately 0.22 Mbits of embedded RAM reduces dependence on external memory for buffering and small data storage needs.
• Industrial Ready: Rated for −40°C to 100°C operation, enabling use in demanding temperature environments.
• Compact Surface-Mount Package: 100-TQFP (100-VQFP, 14×14) supports compact PCB layouts and standard surface-mount assembly processes.
• Low-Voltage Core: Core supply range of 1.14 V to 1.26 V aligns with low-voltage FPGA power architectures.
• RoHS Compliant: Meets common environmental compliance expectations for modern electronics assembly.

Why Choose XC3S200-4VQ100I?

The XC3S200-4VQ100I combines a practical mix of logic elements, on-chip RAM and I/O in a compact surface-mount package designed for industrial temperature operation. It is well suited for designers who need configurable logic and modest embedded memory while maintaining a small PCB footprint.

This device fits applications where moderate gate count, flexible I/O and reliable operation across −40°C to 100°C are key selection criteria, offering a durable platform for mid-range FPGA tasks backed by the Spartan-3 family heritage from AMD.

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