XC3S200-4TQG144I

The XC3S200-4TQG144I is a Spartan-3 field programmable gate array (FPGA) IC from AMD. It provides a moderate logic capacity and on-chip memory in a 144-pin LQFP surface-mount package suitable for industrial-temperature applications.

Key device attributes include 4,320 logic elements, approximately 0.22 Mbits (221,184 bits) of embedded RAM, 97 user I/O pins, about 200,000 gates, a 1.14 V to 1.26 V core supply range, and an operating temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity 4,320 logic elements provide a defined level of programmable logic for implementing custom digital functions.
• Embedded Memory Approximately 0.22 Mbits (221,184 bits) of on-chip RAM for small buffers, FIFOs, and state storage.
• I/O Availability 97 user I/O pins to support multiple external interfaces and peripheral connections.
• Gate Count Approximately 200,000 gates for overall device complexity and design mapping considerations.
• Power Core voltage supply range of 1.14 V to 1.26 V to match system supply requirements.
• Package and Mounting 144-LQFP package (supplier package: 144-TQFP, 20 × 20) in a surface-mount form factor for PCB assembly.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C and listed as Industrial grade.
• Environmental Compliance RoHS compliant.

Typical Applications

• FPGA-based glue logic and system integration — Use the device where moderate programmable logic and flexible I/O are required to implement custom control and interfacing functions.
• Embedded buffering and small storage — Approximately 0.22 Mbits of embedded RAM supports small FIFOs, buffers, and state machines within a design.
• I/O-centric interface tasks — With 97 I/O pins, the device is suitable for designs that require multiple peripheral connections or signal routing in a compact package.

Unique Advantages

• Right-sized logic density: 4,320 logic elements offer a balanced capacity for moderate-complexity designs without excess overhead.
• Embedded memory available: 221,184 bits of on-chip RAM reduce the need for external memory for small storage tasks.
• Compact, surface-mount package: 144-LQFP (20 × 20 equivalent) provides a space-efficient footprint for PCB designs.
• Industrial operating range: −40 °C to 100 °C rating and industrial grade listing support deployment in temperature-challenging environments.
• Regulatory readiness: RoHS compliance simplifies environmental and manufacturing considerations.

Why Choose XC3S200-4TQG144I?

The XC3S200-4TQG144I positions itself as a practical Spartan-3 FPGA option for designs that need a well-defined mix of logic elements, on-chip RAM, and a generous number of I/O pins in a compact 144-LQFP surface-mount package. Its specified gate count and supply-voltage window allow straightforward integration into systems with matching power domains.

This device is suited for engineers and procurement teams seeking an industrial-temperature FPGA with verified on-chip resources and RoHS compliance, offering a stable building block for mid-range programmable logic implementations.

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