XC3S200-4TQG144C

The XC3S200-4TQG144C is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD designed for commercial-grade digital designs. It integrates 4,320 logic elements, approximately 0.22 Mbits of embedded memory, and 97 user I/O pins in a 144-pin LQFP surface-mount package, providing a compact programmable fabric for custom logic implementations.

With a core supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C, this device targets commercial applications that require a balance of integration, I/O density, and on-chip memory.

Key Features

• FPGA Core  Spartan®-3 architecture with 4,320 logic elements and approximately 200,000 gates for implementing custom digital logic.
• Embedded Memory  Approximately 221,184 bits of on-chip RAM to support buffering, state machines, and small data tables.
• I/O Density  97 user I/O pins to support multiple parallel interfaces and peripheral connections in a compact footprint.
• Power  Core voltage supply range of 1.14 V to 1.26 V for the programmable fabric.
• Package & Mounting  144-LQFP surface-mount package; supplier device package listed as 144-TQFP (20×20) to match board-level form-factor requirements.
• Operating Conditions  Commercial-grade operation with an ambient temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant to meet lead-free assembly requirements.

Typical Applications

• Commercial Embedded Systems  Custom logic implementation and peripheral aggregation in commercial electronic products where moderate logic density and on-chip memory are required.
• Prototyping and Development  Platform for validating digital designs and hardware acceleration concepts that leverage 4,320 logic elements and embedded RAM.
• I/O-Intensive Control  Control and interfacing applications that benefit from up to 97 user I/O pins for connecting sensors, actuators, or parallel peripherals.

Unique Advantages

• Balanced Integration: Combines thousands of logic elements with on-chip RAM to implement a wide range of digital functions without immediate need for external memory.
• I/O Capacity: A large number of user I/O pins supports flexible interfacing and reduces the need for external I/O expanders.
• Compact Packaging: 144-pin LQFP surface-mount package provides a compact solution that simplifies board layout for space-constrained designs.
• Commercial-Grade Reliability: Specified for 0 °C to 85 °C operation, aligning with standard commercial product requirements.
• RoHS Compliance: Lead-free compliant construction supports contemporary manufacturing and environmental requirements.
• Known Manufacturer: Designed and supplied by AMD, offering established manufacturing and documentation resources.

Why Choose XC3S200-4TQG144C?

The XC3S200-4TQG144C delivers a practical balance of logic capacity, embedded memory, and I/O in a commercial-grade Spartan®-3 FPGA package. It is suited to designers who need a programmable, compact solution for implementing custom digital logic, control functions, and interface aggregation without extensive external components.

Backed by AMD's product support and documentation, this device offers predictable electrical and thermal characteristics—such as a 1.14 V to 1.26 V core supply and 0 °C to 85 °C operating range—making it a dependable choice for commercial electronic product designs.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the XC3S200-4TQG144C.