XC3S200-4VQ100C
| Part Description |
Spartan®-3 Field Programmable Gate Array (FPGA) IC 63 221184 4320 100-TQFP |
|---|---|
| Quantity | 1,363 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 63 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 480 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | 200000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 221184 |
Overview of XC3S200-4VQ100C – Spartan®-3 FPGA, 100-TQFP
The XC3S200-4VQ100C is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD, supplied in a 100-TQFP surface-mount package. This commercial-grade device provides 4,320 logic elements, approximately 0.22 Mbits of embedded memory (221,184 total RAM bits) and 63 user I/O pins for configurable digital designs.
Key electrical and environmental parameters include a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.
Key Features
- Core Logic 4,320 logic elements and an equivalent of 200,000 gates provide capacity for moderate-complexity digital designs.
- Embedded Memory Approximately 0.22 Mbits of on-chip RAM (221,184 bits) supports local buffering and data storage without immediate need for external memory.
- I/O Count 63 user I/O pins enable connectivity to peripherals, interfaces and external devices.
- Power Nominal supply operation from 1.14 V to 1.26 V, suitable for systems designed around this core voltage range.
- Package and Mounting Available in a 100-TQFP package (supplier device package: 100-VQFP 14×14) with surface-mount mounting for compact PCB integration.
- Thermal and Grade Commercial-grade device rated for 0 °C to 85 °C operation.
- Compliance RoHS compliant for environmental regulatory alignment.
Unique Advantages
- Balanced logic and memory capacity: 4,320 logic elements combined with approximately 0.22 Mbits of embedded RAM allow implementation of integrated logic and data buffering in a single device.
- Moderate gate count for flexible designs: Specified at 200,000 gates to support a range of configurable digital functions without over-provisioning.
- Compact surface-mount package: 100-TQFP (14×14) packaging supports space-efficient PCB layouts while maintaining access to 63 I/O pins.
- Commercial temperature suitability: Rated 0 °C to 85 °C to meet standard commercial application environments.
- Regulatory conformity: RoHS compliance simplifies integration into products targeting regulated markets.
Why Choose XC3S200-4VQ100C?
The XC3S200-4VQ100C offers a practical combination of logic resources, embedded memory and I/O in a compact 100-TQFP surface-mount package. Its commercial temperature rating, defined supply voltage range and RoHS compliance make it a straightforward choice for designers seeking moderate-capacity FPGA functionality in space-constrained PCBs.
This part is well suited to designs that require integrated logic and on-chip RAM with a clear specification set for supply voltage (1.14 V–1.26 V), I/O count (63 pins) and commercial operating temperature. The device provides a verifiable specification package for procurement and system planning.
If you would like pricing, availability or a formal quote for the XC3S200-4VQ100C, please request a quote or submit an RFQ through your preferred procurement channel.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








