XC3S200-4VQG100C

The XC3S200-4VQG100C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC manufactured by AMD. It provides a mid-range array of programmable logic resources and embedded memory in a 100-pin TQFP surface-mount package.

Designed for commercial-grade applications, this device delivers a balance of configurable logic, on-chip RAM, and I/O density for system-level digital integration where moderate gate count and memory are required.

Key Features

• Core Logic — 480 configurable logic blocks (CLBs) supporting a total of 4,320 logic elements (cells) for implementing custom digital functions.
• Embedded Memory — Approximately 0.221 Mbits of on-chip RAM (221,184 total RAM bits) to support buffering, state storage, and local data processing.
• I/O and Gate Count — 63 user I/O pins and approximately 200,000 gates for system interfacing and moderate-complexity designs.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match targeted power-rail designs.
• Package & Mounting — 100-TQFP (specified as 100-VQFP 14×14 by supplier) in a surface-mount form factor for compact PCB layouts.
• Operating Range & Compliance — Commercial temperature grade (0 °C to 85 °C) and RoHS-compliant construction.

Typical Applications

• Custom Digital Logic — Implement application-specific finite state machines, glue logic, and timing-critical control functions using the device’s CLBs and logic elements.
• Prototyping and Evaluation — Use the FPGA’s reprogrammable fabric and on-chip RAM to prototype digital designs and validate system-level behavior.
• I/O Expansion and Bridging — Leverage the 63 I/O pins for signal interfacing, protocol bridging, or expanding connectivity between subsystems.

Unique Advantages

• Balanced Logic Density: 4,320 logic elements provide a practical trade-off between capability and board-level cost for moderate-complexity designs.
• On-Chip Memory: Approximately 0.221 Mbits of embedded RAM reduces external memory requirements for local buffering and control tasks.
• Compact Package: 100-pin TQFP surface-mount package enables space-efficient PCB integration in constrained enclosures.
• Low-Voltage Core: Narrow core supply window (1.14 V–1.26 V) supports predictable power-rail design and integration with compatible regulator designs.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to meet typical commercial electronics environments.
• RoHS Compliant: Conforms to RoHS requirements for lead-free assembly and regulatory considerations.

Why Choose XC3S200-4VQG100C?

The XC3S200-4VQG100C positions itself as a versatile, commercial-grade FPGA option from AMD, offering a practical mix of logic resources, embedded RAM, and I/O in a compact 100-pin TQFP package. It is suited for designers who need reconfigurable logic and local memory without moving to larger, higher-cost devices.

This device is appropriate for development tasks, mid-level digital designs, and systems where a balance of logic capacity, gate count, and package size delivers long-term value through reprogrammability and integration simplicity.

Request a quote or submit a pricing inquiry to learn more about availability and lead times for the XC3S200-4VQG100C.