XC3S200-5PQG208C

The XC3S200-5PQG208C is a Spartan®-3 Field Programmable Gate Array (FPGA) in a 208-BFQFP package designed for commercial embedded logic applications. It offers a balance of configurable logic resources, on-chip memory, and I/O capacity for custom digital designs and prototype-to-production deployments.

With 480 configurable logic blocks (CLBs) providing approximately 4,320 logic elements, 221,184 bits of embedded RAM and 141 user I/O pins, this device supports a range of mid-density logic functions where integration and I/O flexibility are important. The device is RoHS compliant and specified for operation from 0 °C to 85 °C with a primary supply range of 1.14 V to 1.26 V.

Key Features

• Core Logic — 480 configurable logic blocks (CLBs) delivering approximately 4,320 logic elements for implementing custom digital functions and control logic.
• Embedded Memory — Approximately 0.221 Mbits of on-chip RAM (221,184 bits) for buffering, small lookup tables, and state storage without external memory.
• I/O Capacity — 141 user I/O pins to support a wide range of peripheral interfaces, sensor connections and board-level signaling.
• Gate Count — Approximately 200,000 gates of logic capacity to accommodate combinational and sequential designs.
• Power — Specified core supply range of 1.14 V to 1.26 V to match system power-rail requirements.
• Package and Mounting — 208-BFQFP (supplier package: 208-PQFP, 28×28) in a surface-mount package for standard PCB assembly.
• Operating Range — Commercial temperature rating from 0 °C to 85 °C for general-purpose embedded applications.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Embedded Control — Implement custom control logic, state machines, and glue logic for embedded systems using the available CLBs and I/O.
• Sensor and Interface Aggregation — Consolidate multiple sensor inputs and peripheral interfaces using the 141 I/O pins to simplify board-level connectivity.
• Prototyping and Development — Evaluate mid-density FPGA-based designs and validate digital IP with on-chip RAM and flexible logic resources.
• Peripheral Offload — Offload timing-critical or parallel tasks from a microcontroller by implementing dedicated logic functions in the FPGA fabric.

Unique Advantages

• Balanced Logic Density: 480 CLBs and approximately 4,320 logic elements provide the right capacity for mid-range digital designs without excess complexity.
• On-Chip Memory for Local Storage: Approximately 0.221 Mbits of embedded RAM reduces the need for external memory for small buffers and lookup tables.
• High I/O Count: 141 user I/O pins enable rich connectivity for sensors, peripherals, and board-level integration, reducing the need for external multiplexing logic.
• Standard Packaging: 208-BFQFP surface-mount package (208-PQFP, 28×28) supports common PCB assembly flows and form-factor requirements.
• Commercial Temperature Range: Rated for 0 °C to 85 °C to meet general-purpose application environments.
• RoHS Compliant: Meets environmental requirements for lead-free assembly processes.

Why Choose XC3S200-5PQG208C?

The XC3S200-5PQG208C positions itself as a practical, mid-density FPGA option for designers seeking configurable logic, embedded RAM, and substantial I/O in a standard surface-mount BFQFP package. Its combination of CLBs, on-chip memory and I/O capacity makes it suitable for applications that require custom digital processing, peripheral aggregation, or prototype development within a commercial temperature range.

Choosing this device provides a scalable platform for teams that need to consolidate logic functions, reduce external component count, and accelerate time-to-market while retaining the flexibility to modify functionality in the field or during iterative development.

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