XC3S200-5VQG100C

IC FPGA 63 I/O 100VQFP
Part Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 63 221184 4320 100-TQFP

Quantity 279 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package100-VQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-TQFPNumber of I/O63Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs480Number of Logic Elements/Cells4320
Number of Gates200000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits221184

Overview of XC3S200-5VQG100C – Spartan®-3 Field Programmable Gate Array, 100-TQFP

The XC3S200-5VQG100C is a Spartan®-3 Field Programmable Gate Array (FPGA) in a 100-pin TQFP package designed for commercial electronic applications. It provides on-chip logic resources, embedded memory, and a moderate I/O count for implementing custom digital logic in space-constrained surface-mount designs.

Key attributes include 4,320 logic elements, approximately 0.22 Mbits of embedded RAM, 63 user I/Os, a 100-TQFP package (supplier package 100-VQFP 14×14), and a commercial operating range of 0 °C to 85 °C. The device operates from a core supply within 1.14 V to 1.26 V and is RoHS compliant.

Key Features

  • Logic Capacity — 4,320 logic elements provide the programmable resources needed for mid-range digital designs, supporting a variety of custom logic implementations.
  • Embedded Memory — Approximately 0.22 Mbits (221,184 bits) of on-chip RAM for data buffering, state storage, and small FIFOs.
  • I/O Count — 63 available user I/Os to interface with peripherals, sensors, and other system components.
  • Gate Equivalent — 200,000 gates for a clear indication of overall device complexity and integration potential.
  • Power — Core voltage supply range of 1.14 V to 1.26 V, suitable for the device’s specified core power requirements.
  • Package & Mounting — 100-TQFP package with surface-mount mounting type; supplier device package listed as 100-VQFP (14×14).
  • Operating Conditions — Commercial operating temperature range from 0 °C to 85 °C, and RoHS compliance for environmental standards.

Unique Advantages

  • Balanced Logic and Memory — 4,320 logic elements combined with approximately 0.22 Mbits of RAM enable moderate complexity designs without external memory for many use cases.
  • Ample I/O — 63 I/Os provide flexible connectivity for interfaces, allowing integration with a variety of digital peripherals and front-end circuitry.
  • Compact Surface-Mount Package — 100-TQFP packaging supports high-density PCB layouts while remaining compatible with standard surface-mount assembly processes.
  • Commercial Temperature Rating — Rated for 0 °C to 85 °C operation to match typical commercial product requirements.
  • Regulatory Compliance — RoHS-compliant construction supports environmental and manufacturing requirements for commercial electronics.
  • Clear Power Specification — Defined core supply range (1.14 V–1.26 V) supports predictable power design and supply planning.

Why Choose XC3S200-5VQG100C?

The XC3S200-5VQG100C offers a balanced mix of programmable logic, embedded memory, and I/O capacity in a compact 100-pin surface-mount package, making it well suited for commercial electronic designs that require mid-range FPGA capability. Its defined gate count, logic elements, and RAM figures make it straightforward to assess fit for embedded control, custom interfacing, and moderate-density signal processing tasks.

With RoHS compliance and a standard commercial temperature rating, this Spartan®-3 device provides a predictable integration path for product designs where deterministic specifications for logic, memory, I/O, power, and packaging are required.

Request a quote or submit an inquiry to receive pricing and availability information for the XC3S200-5VQG100C.

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