XC3S2000-4FG456I

The XC3S2000-4FG456I is a Spartan®-3 Field Programmable Gate Array (FPGA) IC supplied in a 456-ball BGA footprint. It integrates 5120 configurable logic blocks (CLBs) delivering 46,080 logic elements, approximately 0.74 Mbits of embedded RAM, and up to 333 general-purpose I/O pins.

Designed for industrial environments, the device supports a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C. The package options include a 456-BBGA case with a supplier device package listed as 456-FBGA (23×23), and the part is RoHS compliant.

Key Features

• Logic Capacity — 5120 configurable logic blocks (CLBs) providing a total of 46,080 logic elements to implement complex user-defined digital functions.
• On-chip Memory — Approximately 0.74 Mbits of embedded RAM (737,280 total RAM bits) for intermediate storage, buffering, and state retention within user logic.
• I/O Density — Up to 333 I/O pins to support multiple peripheral interfaces and external device connections.
• Gate Count — Equivalent to 2,000,000 gates for integrating sizeable digital logic into a single FPGA package.
• Power — Supports a core voltage supply range of 1.14 V to 1.26 V to match system power domains.
• Package & Mounting — Surface-mount 456-BBGA package; supplier device package noted as 456-FBGA (23×23) for high-density board integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory Compliance — RoHS compliant for environmental and manufacturing alignment.

Typical Applications

• Industrial Control Systems — Use the industrial temperature rating and high I/O count (333 pins) for sensor aggregation, motor control interfaces, and factory automation logic.
• Embedded Logic and Custom Processing — Leverage 46,080 logic elements and 5120 CLBs to implement custom state machines, protocol handlers, and application-specific datapaths.
• I/O Expansion and Interface Bridging — The large number of general-purpose I/Os supports bridging between multiple peripheral buses or expanding system connectivity without additional components.

Unique Advantages

• High Integration: Combines substantial logic capacity (46,080 logic elements) and on-chip RAM (737,280 bits) to reduce external component count and simplify board design.
• I/O-Rich Design: Up to 333 I/O pins enable complex external interfacing and make the device suitable for multi-sensor and multi-peripheral systems.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, supporting deployment in temperature-challenging industrial applications.
• Compact Packaging: Available in a 456-ball BGA (456-FBGA, 23×23) for high-density PCB layouts and optimized board real estate.
• Standards-Conscious Manufacturing: RoHS compliance assists in meeting environmental and manufacturing requirements.

Why Choose XC3S2000-4FG456I?

The XC3S2000-4FG456I provides a balanced combination of logic capacity, embedded memory, and I/O density in a compact BGA package, making it suitable for engineers building robust, custom digital systems that must operate across an industrial temperature range. Its defined supply voltage range and substantial gate count enable designers to consolidate logic and interfacing tasks into a single programmable device.

For teams seeking a programmable solution that aligns integration, thermal capability, and compliance, the XC3S2000-4FG456I is positioned to deliver long-term value through reduced BOM complexity and flexible hardware configurability.

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