XC3S2000-4FG456C

The XC3S2000-4FG456C is a Spartan®-3 family Field Programmable Gate Array (FPGA) offered in a 456-BBGA package. It provides a balance of programmable logic capacity, embedded memory, and a high I/O count for commercial-grade designs.

With 46,080 logic elements, approximately 0.74 Mbits of embedded memory and 333 user I/Os, this device targets applications that need scalable programmable logic, substantial on-chip RAM, and a compact surface-mount package. It operates from 1.14 V to 1.26 V and is rated for commercial temperatures (0 °C to 85 °C).

Key Features

• Core Logic 46,080 logic elements and approximately 2,000,000 gates to implement complex custom logic and state machines.
• Embedded Memory Approximately 0.74 Mbits of on-chip RAM (737,280 bits) for buffering, FIFOs and data storage within designs.
• I/O Capacity 333 user I/O pins to support multiple interfaces, peripheral connections and parallel buses.
• Package & Mounting 456-BBGA housing (supplier device package: 456-FBGA, 23×23) designed for surface-mount assembly to save board area.
• Power Core supply range from 1.14 V to 1.26 V to match system power domains and regulator choices.
• Operating Range Commercial temperature rating from 0 °C to 85 °C for standard consumer and commercial environments.
• Compliance RoHS compliant manufacturing status to support regulatory restrictions on hazardous substances.

Typical Applications

• Prototyping & Development Implement and iterate custom logic functions and interface prototypes using the device’s large logic and I/O resources.
• Embedded System Logic Integrate control sequencing, glue logic and on-chip buffering where substantial embedded RAM and programmable logic are required.
• Communication Interfaces Bridge and manage multiple parallel or serial interfaces utilizing the 333 I/Os and internal logic resources.
• Consumer and Commercial Electronics Add customizable processing blocks and peripheral control in compact, surface-mount form factors.

Unique Advantages

• High Logic Density: 46,080 logic elements provide substantial capacity for complex state machines, datapaths and custom accelerators.
• Significant On-Chip RAM: Approximately 0.74 Mbits of embedded memory reduces dependence on external RAM for many buffering tasks.
• Extensive I/O Count: 333 I/Os enable multiple parallel interfaces and broad peripheral connectivity without external multiplexing.
• Compact BBGA Package: 456-BBGA (23×23) helps conserve PCB area while supporting surface-mount assembly processes.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for deployment in standard commercial environments.
• RoHS Compliant: Manufactured to meet RoHS requirements for reduced hazardous substances.

Why Choose XC3S2000-4FG456C?

The XC3S2000-4FG456C delivers a substantial mix of programmable logic, on-chip memory and I/O capacity in a compact surface-mount BBGA package. Its combination of 46,080 logic elements, approximately 0.74 Mbits of embedded RAM and 333 I/Os makes it well suited to designs that require on-board reconfigurability and significant internal buffering without excessive board area.

This device is aimed at engineers and teams building commercial-grade electronics who need a proven FPGA platform for prototyping, custom logic implementation and interface consolidation. Its electrical and packaging specifications support integration into a variety of compact system designs while maintaining compliance with RoHS requirements.

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