XC3S200-5TQG144C

IC FPGA 97 I/O 144TQFP
Part Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 97 221184 4320 144-LQFP

Quantity 626 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O97Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs480Number of Logic Elements/Cells4320
Number of Gates200000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits221184

Overview of XC3S200-5TQG144C – Spartan®-3 FPGA, 144-LQFP

The XC3S200-5TQG144C is a Spartan®-3 field programmable gate array (FPGA) from AMD supplied in a 144-LQFP surface-mount package. It provides a balance of logic capacity, on-chip memory and I/O for commercial-temperature embedded designs.

With 4,320 logic elements, approximately 0.22 Mbits of embedded memory and 97 I/O pins, this device targets applications that require moderate programmable logic integration in a compact 144-pin footprint.

Key Features

  • Logic Capacity  4,320 logic elements and a device gate count of 200,000 enable implementation of a range of medium-complexity digital designs.
  • On-Chip Memory  Approximately 0.22 Mbits of embedded RAM (221,184 bits) for data buffering, state storage and local memory needs.
  • I/O Resources  97 user I/O pins provide flexible external connectivity for interfaces, peripherals and board-level integration.
  • Power  Core voltage supply range 1.14 V to 1.26 V to match system-level power requirements.
  • Package & Mounting  144-LQFP package (supplier device package: 144-TQFP 20×20) in a surface-mount form factor for space-constrained PCBs.
  • Temperature & Grade  Commercial operating temperature range of 0 °C to 85 °C; rated for commercial-grade applications.
  • Environmental Compliance  RoHS compliant to support lead-free assembly processes.

Typical Applications

  • Embedded Control  Implement control logic and finite-state machines where moderate logic resources and local RAM are required.
  • Prototyping & Development  Use as a programmable platform for validating digital designs and early system integration in a compact package.
  • I/O Expansion & Interface Bridging  Provide glue logic and protocol adaptation between system peripherals using the device’s 97 I/O pins.

Unique Advantages

  • Balanced Resource Set:  Combines 4,320 logic elements, ~0.22 Mbits of RAM and 97 I/O to support diverse mid-range digital functions without overprovisioning.
  • Compact, Surface-Mount Package:  144-LQFP (144-TQFP supplier format) provides a small board footprint for space-constrained designs.
  • Commercial Temperature Rating:  Rated 0 °C to 85 °C for standard commercial deployments.
  • Tight Core Voltage Range:  Defined supply range (1.14 V–1.26 V) supports predictable power integration into system rails.
  • RoHS Compliant:  Supports lead-free manufacturing and assembly processes.

Why Choose XC3S200-5TQG144C?

The XC3S200-5TQG144C positions itself as a practical FPGA choice for engineers who need moderate programmable logic, embedded memory and ample I/O in a compact commercial-grade package. Its combination of 4,320 logic elements, approximately 0.22 Mbits of on-chip RAM and 97 I/O pins makes it suitable for board-level integration where space and predictable power requirements matter.

Backed by AMD's Spartan-3 family documentation, this device is appropriate for designers and teams seeking a reliable, RoHS-compliant FPGA option for prototyping, embedded control and interface tasks with clear electrical and thermal limits.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S200-5TQG144C.

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