XC3S200-5FTG256C

The XC3S200-5FTG256C is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD supplied in a 256-LBGA package. It delivers a mid-range combination of logic density, embedded memory, and I/O in a commercial-grade FPGA device.

Key device metrics include 4,320 logic elements, approximately 0.221 Mbits of on-chip RAM, 173 I/O, support for a 1.14–1.26 V supply range, and an operating temperature range of 0 °C to 85 °C—making it suitable for commercial product designs that require moderate gate-count FPGA integration.

Key Features

• Core Architecture Spartan®-3 FPGA architecture in the XC3S200-5FTG256C device class providing 4,320 logic elements for mid-range digital design implementations.
• Embedded Memory Approximately 0.221 Mbits of on-chip RAM (221,184 bits) to support buffering, small FIFOs, and local data storage.
• I/O Capacity 173 available I/O pins to interface with peripherals, sensors, and external logic.
• Logic Density Equivalent to 200,000 gates to implement combinational/sequential logic and glue-logic functions.
• Package and Mounting 256-LBGA package case with supplier device package listed as 256-FTBGA (17×17); surface-mount mounting type for PCB integration.
• Power Core voltage supply range of 1.14 V to 1.26 V for device operation.
• Operating Range Commercial-grade device rated for 0 °C to 85 °C operation.
• Compliance RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Implements mid-range logic functions and peripheral interfacing in commercial electronic products where a balance of logic density and I/O is required.
• Prototyping and Development — Used for FPGA-based design iterations and proof-of-concept work that leverage on-chip RAM and a moderate number of logic elements.
• Interface and Glue Logic — Serves as a programmable bridge between digital subsystems, utilizing available I/O and embedded memory for protocol handling and data buffering.

Unique Advantages

• Balanced Logic and Memory: 4,320 logic elements combined with approximately 0.221 Mbits of embedded memory provides a practical balance for mid-range FPGA tasks without excessive device overhead.
• Substantial I/O Count: 173 I/O pins enable flexible connectivity to external peripherals and multiple interfaces on a single device.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation aligns with standard commercial product deployment requirements.
• Compact Package: 256-LBGA / 256-FTBGA (17×17) package supports dense PCB layouts while maintaining surface-mount assembly compatibility.
• Regulatory Compliance: RoHS compliance supports lead-free assembly and regulatory conformity for many commercial supply chains.

Why Choose XC3S200-5FTG256C?

The XC3S200-5FTG256C positions itself as a practical Spartan®-3 family FPGA option for designers seeking a mid-range device from AMD that combines several thousand logic elements, on-chip RAM, and a high I/O count in a compact 256-LBGA package. Its supply voltage range and commercial temperature rating make it appropriate for mainstream commercial electronics.

This device is well suited for design teams that require a straightforward, verifiable FPGA solution for prototyping, glue logic, or feature integration where the specified logic density, memory, I/O capability, and package footprint match the project requirements.

If you would like pricing, availability, or to request a quote for the XC3S200-5FTG256C, submit a request or RFQ and our team will respond with the necessary details.