XC3S200-4VQG100I

IC FPGA 63 I/O 100VQFP
Part Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 63 221184 4320 100-TQFP

Quantity 876 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package100-VQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-TQFPNumber of I/O63Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs480Number of Logic Elements/Cells4320
Number of Gates200000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits221184

Overview of XC3S200-4VQG100I – Spartan®-3 FPGA, 100‑TQFP (Industrial)

The XC3S200-4VQG100I is a Spartan®-3 field programmable gate array (FPGA) IC from AMD, supplied in a 100‑pin TQFP package. It provides a compact, industrial‑grade programmable logic solution that integrates logic capacity, embedded memory, and I/O in a surface‑mount package for designs requiring reconfigurable hardware within an extended temperature range.

Key Features

  • Logic Capacity — 4,320 logic elements and approximately 200,000 gates provide fabric for custom logic and glue‑logic implementations.
  • Embedded Memory — Approximately 0.221 Mbits of on‑chip RAM to support buffering, state storage, and small local memories.
  • I/O — 63 available I/O lines for peripheral interfacing and system integration.
  • Power — Core supply range from 1.14 V to 1.26 V to match system power rails and design requirements.
  • Package & Mounting — 100‑pin TQFP surface‑mount package; supplier device package listed as 100‑VQFP (14×14), supporting compact PCB layouts.
  • Operating Range — Industrial temperature rating from −40°C to 100°C for deployment in challenging environments.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial Control — Reconfigurable logic for control systems and automation that benefit from the device’s industrial temperature range and programmable functionality.
  • Custom Interface and Glue Logic — Implement protocol translation, bus interfacing, and custom I/O functions using the device’s 63 I/O and 4,320 logic elements.
  • Embedded System Integration — On‑chip memory and logic resources support compact embedded designs where board area and component count are constrained.

Unique Advantages

  • Compact, integrated solution: Combines thousands of logic elements, embedded RAM, and 63 I/O in a single 100‑pin package to reduce board-level component count.
  • Industrial temperature capability: Rated from −40°C to 100°C to meet the thermal requirements of industrial deployments.
  • Low-voltage core operation: Core supply range of 1.14 V to 1.26 V enables compatibility with common low‑voltage power architectures.
  • RoHS compliant: Meets lead‑free and environmental material requirements for modern electronic assemblies.
  • Manufacturer support: Offered by AMD, providing continuity of supply and documentation for integration.

Why Choose XC3S200-4VQG100I?

The XC3S200-4VQG100I positions itself as an industrial‑grade, compact FPGA option that blends moderate logic capacity, embedded memory, and a useful complement of I/O in a 100‑pin surface‑mount package. Its operating voltage range and −40°C to 100°C rating make it suitable for systems that require reliable programmable logic in temperature‑challenging environments.

This device is appropriate for engineers and procurement teams seeking a Spartan®-3 family FPGA from AMD when a balance of integration, I/O capability, and industrial temperature performance is required, while keeping board footprint and part count minimized.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S200-4VQG100I.

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