XC3S200-4VQG100I
| Part Description |
Spartan®-3 Field Programmable Gate Array (FPGA) IC 63 221184 4320 100-TQFP |
|---|---|
| Quantity | 876 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 63 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 480 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | 200000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 221184 |
Overview of XC3S200-4VQG100I – Spartan®-3 FPGA, 100‑TQFP (Industrial)
The XC3S200-4VQG100I is a Spartan®-3 field programmable gate array (FPGA) IC from AMD, supplied in a 100‑pin TQFP package. It provides a compact, industrial‑grade programmable logic solution that integrates logic capacity, embedded memory, and I/O in a surface‑mount package for designs requiring reconfigurable hardware within an extended temperature range.
Key Features
- Logic Capacity — 4,320 logic elements and approximately 200,000 gates provide fabric for custom logic and glue‑logic implementations.
- Embedded Memory — Approximately 0.221 Mbits of on‑chip RAM to support buffering, state storage, and small local memories.
- I/O — 63 available I/O lines for peripheral interfacing and system integration.
- Power — Core supply range from 1.14 V to 1.26 V to match system power rails and design requirements.
- Package & Mounting — 100‑pin TQFP surface‑mount package; supplier device package listed as 100‑VQFP (14×14), supporting compact PCB layouts.
- Operating Range — Industrial temperature rating from −40°C to 100°C for deployment in challenging environments.
- Compliance — RoHS compliant.
Typical Applications
- Industrial Control — Reconfigurable logic for control systems and automation that benefit from the device’s industrial temperature range and programmable functionality.
- Custom Interface and Glue Logic — Implement protocol translation, bus interfacing, and custom I/O functions using the device’s 63 I/O and 4,320 logic elements.
- Embedded System Integration — On‑chip memory and logic resources support compact embedded designs where board area and component count are constrained.
Unique Advantages
- Compact, integrated solution: Combines thousands of logic elements, embedded RAM, and 63 I/O in a single 100‑pin package to reduce board-level component count.
- Industrial temperature capability: Rated from −40°C to 100°C to meet the thermal requirements of industrial deployments.
- Low-voltage core operation: Core supply range of 1.14 V to 1.26 V enables compatibility with common low‑voltage power architectures.
- RoHS compliant: Meets lead‑free and environmental material requirements for modern electronic assemblies.
- Manufacturer support: Offered by AMD, providing continuity of supply and documentation for integration.
Why Choose XC3S200-4VQG100I?
The XC3S200-4VQG100I positions itself as an industrial‑grade, compact FPGA option that blends moderate logic capacity, embedded memory, and a useful complement of I/O in a 100‑pin surface‑mount package. Its operating voltage range and −40°C to 100°C rating make it suitable for systems that require reliable programmable logic in temperature‑challenging environments.
This device is appropriate for engineers and procurement teams seeking a Spartan®-3 family FPGA from AMD when a balance of integration, I/O capability, and industrial temperature performance is required, while keeping board footprint and part count minimized.
Request a quote or submit an inquiry to obtain pricing and availability for the XC3S200-4VQG100I.

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