XC3S2000-4FG900I

The XC3S2000-4FG900I is a Spartan®-3 Field Programmable Gate Array (FPGA) IC designed for applications that require substantial logic density and high I/O counts. This industrial-grade, surface-mount device delivers a balance of on-chip memory, logic resources, and I/O capacity for demanding embedded designs.

Key technical attributes include 46,080 logic elements, approximately 0.74 Mbits of embedded RAM, and 565 user I/O pins, making it suited to designs that need significant programmable logic and broad external interfacing while operating across a wide industrial temperature range.

Key Features

• Logic Capacity  46,080 logic elements provide extensive programmable logic resources for implementing complex digital functions.
• On‑Chip Memory  Approximately 0.74 Mbits (737,280 bits) of embedded RAM to support buffering, state storage, and local data processing.
• I/O Density  565 user I/O pins support wide external interfacing and parallel connectivity without additional interface logic.
• Gate Count  Approximately 2,000,000 gates for substantial functional integration on a single device.
• Power  Core supply range from 1.14 V to 1.26 V for low-voltage operation.
• Package and Mounting  900-BBGA package (supplier device package: 900-FBGA, 31×31) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Range  Rated for −40°C to 100°C operation, suitable for industrial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑density logic implementations: Use where up to 46,080 logic elements are required to implement complex digital functions on a single chip.
• I/O‑intensive systems: Ideal for designs that need many external interfaces or parallel connectivity, leveraging 565 user I/O pins.
• Embedded memory buffering: Applications that benefit from approximately 0.74 Mbits of on‑chip RAM for local data storage and fast access.
• Industrial equipment and controls: Suited to industrial applications that require operation across −40°C to 100°C and industrial-grade components.

Unique Advantages

• High logic density: 46,080 logic elements enable consolidation of multiple functions into a single programmable device, reducing board-level component count.
• Extensive I/O capability: 565 I/O pins provide flexibility for complex peripheral interfacing and parallel data paths.
• On‑chip memory for performance: Approximately 0.74 Mbits of embedded RAM supports local buffering and state retention without external memory.
• Compact, mountable package: 900-BBGA (900-FBGA, 31×31) surface-mount package helps save PCB area while supporting high pin counts.
• Industrial temperature support: Rated for −40°C to 100°C, offering reliability for harsh or variable environments.
• RoHS compliant: Meets environmental compliance requirements for lead‑free manufacturing processes.

Why Choose XC3S2000-4FG900I?

The XC3S2000-4FG900I positions itself as a high-capacity, industrial-grade Spartan®-3 FPGA option for designs that demand substantial programmable logic, significant on-chip memory, and a large number of I/O pins. Its combination of 46,080 logic elements, approximately 0.74 Mbits of embedded RAM, and 565 I/O points enables integration of complex digital subsystems while minimizing additional components.

This device is a practical choice for engineers and procurement teams building industrial and embedded systems that require dense logic integration, broad interfacing capabilities, and temperature resilience, offering design scalability and component consolidation on a single surface-mount package.

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