XC3S2000-4FGG676C

The XC3S2000-4FGG676C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD. It delivers high-density programmable logic, abundant on-chip memory, and a large I/O count in a compact 676-BGA package for commercial-grade embedded designs.

With 46,080 logic elements, approximately 737,280 bits of embedded RAM, and 489 I/O, this device targets designs that require substantial custom logic integration, on-chip storage, and wide external connectivity while operating within standard commercial temperature and voltage ranges.

Key Features

• Logic Capacity — 46,080 logic elements and 5,120 CLBs provide significant programmable logic resources for large custom functions.
• On‑Chip Memory — Approximately 737,280 bits of embedded RAM to support buffering, state storage, and memory-mapped logic.
• I/O and Gate Count — 489 I/O pins and approximately 2,000,000 gates enable extensive external interfacing and complex system logic.
• Package & Mounting — 676-BGA package (supplier device package: 676-FBGA, 27×27) in a surface-mount form factor for dense board layouts.
• Power — Specified supply voltage range of 1.14 V to 1.26 V to match system power requirements.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density logic integration — Implement large custom logic blocks and state machines using the device’s 46,080 logic elements and 5,120 CLBs.
• Memory‑centric designs — Use approximately 737,280 bits of on-chip RAM for buffering, FIFOs, and embedded data storage.
• Multi‑interface systems — Support designs requiring extensive external connectivity with 489 programmable I/O pins.

Unique Advantages

• Substantial programmable capacity — High logic element and CLB counts let designers consolidate multiple functions into a single FPGA, reducing external components.
• Embedded memory availability — Nearly three-quarters of a megabit of on-chip RAM reduces the need for external memory in many applications.
• Extensive external connectivity — 489 I/O pins accommodate numerous interfaces and parallel buses without sacrificing routing flexibility.
• Compact, board‑friendly package — 676-FBGA (27×27) surface-mount package enables high-density PCB designs while maintaining reliable solder connections.
• Commercial temperature and RoHS compliance — Clear operational and environmental specs help streamline selection for mainstream embedded products.

Why Choose XC3S2000-4FGG676C?

The XC3S2000-4FGG676C positions itself as a capable, commercial-grade Spartan®-3 FPGA that balances high logic capacity, substantial embedded memory, and a large I/O count in a compact 676-BGA package. Its defined voltage range and operating temperature make it suitable for a wide range of mainstream embedded applications that require dense programmable logic and on-chip storage.

This FPGA is well suited to design teams seeking to consolidate system functions, reduce BOM complexity, and deploy scalable programmable logic with RoHS compliance and reliable surface-mount packaging from a recognized manufacturer, AMD.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S2000-4FGG676C and to discuss how this Spartan®-3 FPGA can fit into your next design.