XC3S2000-4FGG900C

The XC3S2000-4FGG900C is a Spartan®‑3 Field Programmable Gate Array (FPGA) IC from AMD. It delivers a programmable logic platform with 46,080 logic elements and approximately 0.74 Mbits of embedded memory for mid-density digital designs.

With up to 565 I/O, a 900‑BBGA package, and a 1.14 V to 1.26 V core supply range, this commercial‑grade device targets applications that require significant I/O connectivity and on-chip logic/memory integration within a surface‑mount package.

Key Features

• Logic Capacity  46,080 logic elements provide substantial programmable logic resources for mid-density designs and complex glue‑logic implementations.
• Embedded Memory  Approximately 0.74 Mbits of on‑chip RAM support buffering, small data storage and local scratchpad memory without external RAM.
• I/O Density  Up to 565 I/O pins enable extensive peripheral interfacing and multi‑channel connectivity within a single device.
• Gate Count  Around 2,000,000 gates for mapped design complexity and feature integration.
• Power  Core supply range of 1.14 V to 1.26 V to match system power rails and FPGA core requirements.
• Package & Mounting  900‑BBGA package (supplier device package: 900‑FBGA, 31×31) in a surface‑mount form factor for compact board designs.
• Operating Range & Grade  Commercial grade device specified for 0 °C to 85 °C operation.
• Compliance  RoHS compliant to support modern environmental requirements.

Typical Applications

• High‑density digital logic  Implement state machines, protocol bridges and custom processing pipelines using the device's 46,080 logic elements and 2,000,000 gate capacity.
• I/O‑intensive interfaces  Support multi‑channel interfaces and peripheral aggregation with up to 565 I/O pins in a single FPGA package.
• On‑chip buffering and control  Leverage approximately 0.74 Mbits of embedded RAM for local data buffering, FIFOs or small lookup tables to reduce external memory needs.
• Compact board designs  Surface‑mount 900‑BBGA packaging enables space‑constrained PCBs while preserving high I/O and logic density.

Unique Advantages

• Substantial programmable logic: 46,080 logic elements accommodate complex combinational and sequential logic without partitioning across multiple devices.
• High I/O count: 565 I/O pins reduce the need for external multiplexing or additional interface chips, simplifying board routing and BOM.
• On‑chip memory: Approximately 0.74 Mbits of embedded RAM allow local data handling that can lower external memory requirements and improve throughput.
• Compact packaging: 900‑BBGA (31×31) surface‑mount package supports dense, cost‑sensitive board layouts while providing robust connectivity.
• Commercial temperature range: Rated for 0 °C to 85 °C operation to match standard commercial electronics deployment scenarios.
• Regulatory compliance: RoHS compliance supports environmental and regulatory objectives in product development.

Why Choose XC3S2000-4FGG900C?

The XC3S2000-4FGG900C positions itself as a mid‑density Spartan‑3 FPGA offering a balanced mix of logic, memory and I/O integration suitable for designers who need considerable programmable resources in a single surface‑mount package. Its combination of 46,080 logic elements, approximately 0.74 Mbits of embedded RAM and 565 I/O pins makes it well suited for applications requiring integrated logic and interface consolidation.

Manufactured by AMD and specified for commercial operation, this device delivers a scalable, RoHS‑compliant FPGA option that fits compact board designs while providing the on‑chip resources necessary to reduce external components and simplify system architecture.

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