XC3S2000-5FGG900C

The XC3S2000-5FGG900C is a Spartan®-3 field programmable gate array from AMD designed for commercial-grade programmable logic applications. It delivers substantial on-chip resources—including 46,080 logic elements and approximately 0.74 Mbits of embedded memory—along with a high I/O count and a compact ball-grid array package for surface-mount assembly.

This device targets designs that require a balance of logic capacity, embedded RAM, and dense I/O in a 900-ball BGA package, while operating across a standard commercial temperature range and a defined core voltage window.

Key Features

• Logic Capacity — 46,080 logic elements provide significant programmable logic resources for mid-density designs.
• Embedded Memory — Approximately 0.74 Mbits of on-chip RAM (737,280 total RAM bits) for data buffering, state storage, and small lookup tables.
• I/O Density — Up to 565 I/O pins to support multiple parallel interfaces and high-pin-count system requirements.
• Gate Equivalent — Approximately 2,000,000 gates for overall design complexity estimation and system partitioning.
• Power and Core Voltage — Specified supply range of 1.14 V to 1.26 V for the core supply.
• Package and Mounting — 900-BBGA package case; supplier device package listed as 900-FBGA (31×31). Surface-mount mounting type simplifies PCB assembly for compact systems.
• Operating Range and Grade — Commercial grade with operating temperature from 0 °C to 85 °C.
• Compliance — RoHS compliant for environmental and regulatory alignment.

Unique Advantages

• High logic density: 46,080 logic elements enable substantial on-chip implementation without immediate need for external programmable logic.
• Significant embedded RAM: Approximately 0.74 Mbits of on-chip memory reduces dependence on external RAM for small-to-medium data storage tasks.
• Extensive I/O capability: 565 I/O pins support complex interfacing options and multiple parallel connections, simplifying board-level I/O routing.
• Compact BGA packaging: 900-ball BGA in a 31×31 footprint allows a high-pin-count device in a space-efficient form factor suitable for dense PCB layouts.
• Commercial temperature suitability: Rated 0 °C to 85 °C to match mainstream commercial deployments and standard environmental requirements.
• Regulatory alignment: RoHS compliance supports assembly and manufacturing processes that require lead-free component selections.

Why Choose XC3S2000-5FGG900C?

The XC3S2000-5FGG900C positions itself as a well-rounded commercial-grade Spartan®-3 FPGA offering a blend of logic capacity, embedded RAM, and high I/O count in a 900-ball BGA package. Its specification set—46,080 logic elements, approximately 0.74 Mbits of on-chip memory, 565 I/Os, and roughly 2,000,000 gates—makes it suitable for designs that need moderate to high programmable logic resources within a compact surface-mount footprint.

For development teams and procurement focused on commercial applications that require predictable operating temperature limits and RoHS compliance, this device provides a clear specification-driven solution that balances integration, density, and manufacturability while adhering strictly to the listed electrical and mechanical parameters.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for the XC3S2000-5FGG900C.