XC3S200A-4FGG320I

The XC3S200A-4FGG320I is a Spartan®-3A field programmable gate array (FPGA) in a 320-ball BGA package targeted at industrial applications. It integrates configurable logic, embedded RAM, and a high I/O count in a surface-mount 320-FBGA (19×19) package, providing a compact reconfigurable solution for designs that require moderate logic density and industrial-grade operating conditions.

Key Features

• Core Logic  448 CLBs with 4,032 logic elements provide approximately 200,000 gates of programmable logic for implementing custom digital functions.
• Embedded Memory  Approximately 0.295 Mbits (294,912 bits) of on-chip RAM to support data buffering, state storage, and small embedded memory needs without external components.
• I/O Capacity  248 user I/O pins enable extensive external interfacing and connectivity for sensors, buses, and peripheral devices.
• Package & Mounting  320-BGA package (supplier device package: 320-FBGA, 19×19) designed for surface-mount assembly to support compact board layouts.
• Power  Operates from a core voltage supply range of 1.14 V to 1.26 V for compatibility with standard FPGA power-rail designs.
• Operating Temperature  Industrial-grade temperature range from −40 °C to 100 °C for reliable operation in demanding environments.
• Environmental Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• Industrial automation  Implement control logic and interface functions for factory equipment and process controllers that require industrial-temperature operation.
• Industrial instrumentation  Embed custom signal conditioning, data aggregation, and logic processing directly on instrumentation PCBs using the device’s logic and on-chip RAM.
• Compact embedded systems  Provide reconfigurable logic and I/O in space-constrained designs that benefit from a BGA surface-mount footprint and moderate gate density.

Unique Advantages

• Balanced logic density: The combination of 448 CLBs and 4,032 logic elements delivers sufficient programmable resources for mid-range logic implementations without excessive board real estate.
• On-chip memory for reduced BOM: Approximately 0.295 Mbits of embedded RAM reduces dependence on external memory components for buffering and small data storage tasks.
• High I/O count: 248 I/O pins simplify system integration by enabling direct connection to multiple peripherals and buses.
• Industrial readiness: Rated for −40 °C to 100 °C operation and specified as industrial grade for use in temperature-demanding applications.
• Compact package: 320-FBGA (19×19) surface-mount package supports dense PCB designs while maintaining necessary signal routing and assembly methods.
• Regulatory compliance: RoHS compliance supports lead-free manufacturing processes and regulatory requirements.

Why Choose XC3S200A-4FGG320I?

The XC3S200A-4FGG320I positions itself as a practical, industrial-grade FPGA option for designs that need moderate programmable logic, embedded RAM, and a high I/O count in a compact BGA package. Its combination of 4,032 logic elements, nearly 0.295 Mbits of on-chip RAM, and 248 I/Os offers designers a balanced platform for implementing custom digital functions while minimizing external components.

This device is well suited for engineers developing industrial control, instrumentation, or space-constrained embedded systems that demand reliable operation across a wide temperature range. Its surface-mount 320-FBGA package and RoHS compliance support modern assembly processes and compact board designs.

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