XC3S200A-4FTG256C

The XC3S200A-4FTG256C is a Spartan®-3A Field Programmable Gate Array (FPGA) from AMD, offered in a 256-LBGA package. It delivers a balanced combination of programmable logic, embedded memory and a high I/O count for commercial-grade designs requiring configurable digital logic.

Key on-chip resources include 4,032 logic elements, approximately 0.295 Mbits of embedded RAM, and 195 I/O pins, with a specified supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 4,032 logic elements provide configurable digital resources suitable for custom logic and prototype implementations.
• Embedded Memory Approximately 0.295 Mbits (294,912 bits) of on-chip RAM to support buffering, small lookup tables and state storage.
• I/O Density 195 I/O pins enable connectivity to a wide range of peripherals and board-level interfaces.
• Logic Capacity Equivalent to 200,000 gates of logic capacity for mid-range programmable logic requirements.
• Power Specified supply voltage range of 1.14 V to 1.26 V for predictable power planning and system integration.
• Package & Mounting 256-LBGA package (supplier device package: 256-FTBGA, 17 × 17) with surface-mount construction for compact board designs.
• Temperature Grade Commercial operating range from 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance RoHS compliant.

Typical Applications

• Custom Digital Logic and Prototyping — Use the 4,032 logic elements and on-chip RAM to implement and validate bespoke logic functions and proof-of-concept designs.
• I/O-Intensive Interfaces — High I/O count (195 pins) supports designs that require multiple parallel interfaces or dense peripheral connectivity.
• Board-Level Integration — Compact 256-LBGA package and surface-mount mounting make the device suitable for space-constrained commercial boards.

Unique Advantages

• Balanced Logic and Memory — The combination of 4,032 logic elements and ~0.295 Mbits of embedded RAM supports a wide range of mid-range FPGA tasks without excessive external memory.
• High I/O Capacity — 195 I/O pins allow flexible interfacing to sensors, controllers and other board-level components, reducing the need for external glue logic.
• Compact, Surface-Mount Package — 256-LBGA (256-FTBGA, 17×17) provides a small footprint for dense PCB layouts while supporting standard surface-mount assembly.
• Defined Power Envelope — A narrow supply range (1.14 V–1.26 V) simplifies power supply design and system-level power budgeting.
• Commercial Temperature Rating — Rated for 0 °C to 85 °C operation to match typical commercial product environments.
• Regulatory Compatibility — RoHS compliance supports environmentally conscious product development and manufacturing.

Why Choose XC3S200A-4FTG256C?

The XC3S200A-4FTG256C delivers a practical mix of logic resources, embedded memory and I/O in a compact 256-LBGA package, positioned for commercial-grade designs that require configurable digital functionality. Its defined supply voltage and temperature range make integration straightforward for board-level digital systems.

This device is appropriate for engineers and teams building mid-range programmable logic solutions that value a compact footprint, substantial I/O capability and the predictable resource set provided by the Spartan®-3A family from AMD.

Request a quote or submit an inquiry for the XC3S200A-4FTG256C to get pricing and availability for your next design.