XC3S200A-4FTG256I

The XC3S200A-4FTG256I is a Spartan®-3A field programmable gate array (FPGA) IC from AMD delivered in a 256-LBGA package. It provides a balanced combination of logic capacity, embedded memory, and I/O count in a surface-mount form factor.

With 4,032 logic elements, approximately 0.295 Mbits of on-chip RAM, and 195 I/O, this industrial-grade device supports designs that require moderate logic density, on-chip storage, and a wide operating temperature range while operating at a core supply between 1.14 V and 1.26 V.

Key Features

• FPGA Core  Spartan®-3A field programmable gate array architecture offering 4,032 logic elements and 200,000 gates for configurable digital logic implementation.
• Embedded Memory  Total on-chip RAM of 294,912 bits, approximately 0.295 Mbits of embedded memory for buffering, state storage, or small lookup tables.
• I/O Capacity  195 user I/O pins to support a variety of external interfaces and peripheral connections.
• Package  256-LBGA package (supplier device package: 256-FTBGA, 17×17) in a surface-mount format for compact board-level integration.
• Power  Core supply voltage range from 1.14 V to 1.26 V to match system power domains and enable consistent device operation.
• Operating Range & Grade  Industrial grade device rated for operation from −40°C to 100°C for deployment in temperature-demanding environments.
• Mounting Type  Surface mount packaging enables automated PCB assembly and reliable soldered connections.

Unique Advantages

• Balanced Logic and Memory: 4,032 logic elements paired with approximately 0.295 Mbits of embedded RAM provide a useful mix of compute and storage for mid-range FPGA tasks.
• Generous I/O Count: 195 I/O pins offer flexibility for interfacing with multiple peripherals, sensors, and external devices without immediate need for I/O expanders.
• Industrial Temperature Capability: Rated −40°C to 100°C to support deployment in systems exposed to wide temperature swings.
• Compact, Serviceable Package: 256-LBGA (17×17 FTBGA) permits dense PCB layouts while maintaining a standard surface-mount assembly profile.
• Low-Voltage Operation: Narrow core voltage range (1.14 V to 1.26 V) aligns with modern low-voltage designs and power rails.

Why Choose XC3S200A-4FTG256I?

The XC3S200A-4FTG256I positions itself as a reliable, industrial-grade Spartan®-3A FPGA option when designs require a moderate amount of configurable logic, embedded RAM, and broad I/O capability in a compact LBGA package. Its specified voltage and temperature ranges make it suitable for applications that demand consistent operation across varied environments.

This part is appropriate for engineers and procurement teams seeking a field-programmable solution from AMD with clearly defined logic, memory, and interface resources for mid-range digital designs.

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